Chipkind 전자 - IC 소켓 - Sockets for ICs, Transistors - 페이지 93 - 원본 상품 출처 - Chipkind 전자- IC 유통업체 및 전자 부품 공급업체

제조업체 부품 번호	가격	수량	데이터시트	시리즈	패키징	제품 상태	유형	위치 또는 핀 수(그리드)	피치 - Mating	접촉 마감 - 결합	접촉 마감 두께 - Mating	접촉 재료 - Mating	장착 유형	기능	종단	피치 - 포스트	접촉 마감 - 포스트	접촉 마감 두께 - 포스트	접촉 재료 - 포스트	하우징 소재	작동 온도
114-83-306-41-117101 CONN IC DIP SOCKET 6POS GOLD Preci-Dip	-	RFQ	데이터시트	114	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
114-83-306-41-134161 CONN IC DIP SOCKET 6POS GOLD Preci-Dip	-	RFQ	데이터시트	114	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
SIP1X12-014B SIP1X12-014B-SIP SOCKET 12 CTS Amphenol ICC (FCI)	-	RFQ	데이터시트	SIP1x	Bulk	Active	SIP	12 (1 x 12)	0.100" (2.54mm)	Tin-Lead	150.0µin (3.81µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-
SIP1X10-001B SIP1X10-001B-SIP SOCKET 10 CTS Amphenol ICC (FCI)	-	RFQ	데이터시트	SIP1x	Bulk	Active	SIP	10 (1 x 10)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-
HLS-0101-G-10 .100" SCREW MACHINE SOCKET ARRAY Samtec Inc.	-	RFQ	데이터시트	HLS	Tube	Active	SIP	1 (1 x 1)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	-	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	-	Thermoplastic	-55°C ~ 140°C
116-87-306-41-003101 CONN IC DIP SOCKET 6POS GOLD Preci-Dip	-	RFQ	데이터시트	116	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
940-99-028-24-000000 CONN SOCKET PLCC 28POS TIN-LEAD Mill-Max Manufacturing Corp.	-	RFQ	데이터시트	940	Tube	Obsolete	PLCC	28 (4 x 7)	0.100" (2.54mm)	Tin-Lead	100.0µin (2.54µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
AR 14 HGL-TT SOCKET Assmann WSW Components	-	RFQ	데이터시트	AR	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	Flash	Brass	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
AR20-HZL/01-TT CONN IC DIP SOCKET 20POS GOLD Assmann WSW Components	-	RFQ	데이터시트	-	Bag	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester	-40°C ~ 105°C
241-16-1-03 CONN IC DIP SOCKET 16POS TIN CNC Tech	-	RFQ	데이터시트	-	Tube	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
A06-LCG-T-R CONN IC DIP SOCKET 6POS GOLD Assmann WSW Components	-	RFQ	데이터시트	-	Tube	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	-	-	Through Hole	-	Solder	0.100" (2.54mm)	Gold	-	-	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 105°C
A-CCS68-Z CONN SOCKET PLCC 68POS TIN Assmann WSW Components	-	RFQ	데이터시트	-	Bag	Obsolete	PLCC	68 (4 x 17)	0.050" (1.27mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 105°C
HLS-0101-T-12 .100" SCREW MACHINE SOCKET ARRAY Samtec Inc.	-	RFQ	데이터시트	HLS	Tube	Active	SIP	1 (1 x 1)	0.100" (2.54mm)	Tin	-	-	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	-	-	-	Thermoplastic	-55°C ~ 140°C
AW 127-24/Z-T SOCKET 24 CONTACTS SINGLE ROW Assmann WSW Components	-	RFQ	데이터시트	-	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
110-83-306-41-605101 CONN IC DIP SOCKET 6POS GOLD Preci-Dip	-	RFQ	데이터시트	110	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
03-0513-10T CONN SOCKET SIP 3POS GOLD Aries Electronics	-	RFQ	데이터시트	0513	Bulk	Active	SIP	3 (1 x 3)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
HLS-0102-S-2 .100" SCREW MACHINE SOCKET ARRAY Samtec Inc.	-	RFQ	데이터시트	HLS	Tube	Active	SIP	2 (1 x 2)	0.100" (2.54mm)	Gold	-	-	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	-	-	-	Thermoplastic	-55°C ~ 140°C
AR 24-HZL/7-TT CONN IC DIP SOCKET 24POS TIN Assmann WSW Components	-	RFQ	데이터시트	-	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
SIP1X12-011B SIP1X12-011B-SIP SOCKET 12 CTS Amphenol ICC (FCI)	-	RFQ	데이터시트	SIP1x	Bulk	Active	SIP	12 (1 x 12)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-
2-382189-1 CONN IC DIP SOCKET 32POS TIN TE Connectivity AMP Connectors	-	RFQ	데이터시트	Diplomate DL	Tube	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Beryllium Copper	Thermoplastic	-

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