Chipkind 전자 - IC 소켓 - Sockets for ICs, Transistors - 페이지 89 - 원본 상품 출처 - Chipkind 전자- IC 유통업체 및 전자 부품 공급업체

제조업체 부품 번호	가격	수량	데이터시트	시리즈	패키징	제품 상태	유형	위치 또는 핀 수(그리드)	피치 - Mating	접촉 마감 - 결합	접촉 마감 두께 - Mating	접촉 재료 - Mating	장착 유형	기능	종단	피치 - 포스트	접촉 마감 - 포스트	접촉 마감 두께 - 포스트	접촉 재료 - 포스트	하우징 소재	작동 온도
1571994-2 CONN SOCKET SIP 2POS GOLD TE Connectivity AMP Connectors	-	RFQ	데이터시트	510	Bulk	Obsolete	SIP	2 (1 x 2)	0.100" (2.54mm)	Gold	20.0µin (0.51µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	20.0µin (0.51µm)	Copper	Thermoplastic, Polyester	-
612-83-304-41-001101 CONN IC DIP SOCKET 4POS GOLD Preci-Dip	-	RFQ	데이터시트	612	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	4 (2 x 2)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
SIP1X05-041B SIP1X05-041B-SIP SOCKET 5 CTS Amphenol ICC (FCI)	-	RFQ	데이터시트	SIP1x	Bulk	Active	SIP	5 (1 x 5)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-
1-390263-5 CONN IC DIP SOCKET 42POS TIN TE Connectivity AMP Connectors	-	RFQ	데이터시트	-	Tube	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	42 (2 x 21)	0.100" (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	-	-40°C ~ 105°C
1-390262-6 CONN IC DIP SOCKET 42POS TIN TE Connectivity AMP Connectors	-	RFQ	데이터시트	-	Box	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	42 (2 x 21)	0.100" (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	-	-40°C ~ 105°C
614-87-306-41-001101 CONN IC DIP SOCKET 6POS GOLD Preci-Dip	-	RFQ	데이터시트	614	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
AR 22-HZL/7-TT SOCKET Assmann WSW Components	-	RFQ	데이터시트	AR	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	22 (2 x 11)	0.100" (2.54mm)	Gold	Flash	Brass	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
110-87-306-41-105101 CONN IC DIP SOCKET 6POS GOLD Preci-Dip	-	RFQ	데이터시트	110	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
A-CCS28-Z-SM CONN SOCKET PLCC 28POS TIN Assmann WSW Components	-	RFQ	데이터시트	-	Bag	Obsolete	PLCC	28 (4 x 7)	0.050" (1.27mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 105°C
A18-LCG CONN IC DIP SOCKET 18POS GOLD Assmann WSW Components	-	RFQ	데이터시트	-	-	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Gold	-	-	Through Hole	Open Frame	-	0.100" (2.54mm)	Gold	-	-	-	-
AW 127-20/Z-T SOCKET 20 CONTACTS SINGLE ROW Assmann WSW Components	-	RFQ	데이터시트	-	Bulk	Active	SIP	20 (1 x 20)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyphenylene Sulfide (PPS)	-40°C ~ 105°C
612-87-306-41-001101 CONN IC DIP SOCKET 6POS GOLD Preci-Dip	-	RFQ	데이터시트	612	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
A-CCS32-Z-SM CONN SOCKET PLCC 32POS TIN Assmann WSW Components	-	RFQ	데이터시트	-	Bag	Obsolete	PLCC	32 (2 x 7, 2 x 9)	0.050" (1.27mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 105°C
03-0518-10T CONN SOCKET SIP 3POS GOLD Aries Electronics	-	RFQ	데이터시트	518	Bulk	Active	SIP	3 (1 x 3)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
01-0517-90C CONN SOCKET SIP 1POS GOLD Aries Electronics	-	RFQ	데이터시트	0517	Bulk	Active	SIP	1 (1 x 1)	-	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle	-	Solder	-	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
AR16-HZL/07-TT CONN IC DIP SOCKET 16POS GOLD Assmann WSW Components	-	RFQ	데이터시트	-	Bag	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester	-40°C ~ 105°C
116-87-304-41-002101 CONN IC DIP SOCKET 4POS GOLD Preci-Dip	-	RFQ	데이터시트	116	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	4 (2 x 2)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
241-06-1-03 CONN IC DIP SOCKET 6POS TIN CNC Tech	-	RFQ	데이터시트	-	Tube	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
AR 10-HZL/01-TT CONN IC DIP SOCKET 10POS TIN Assmann WSW Components	-	RFQ	데이터시트	-	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
A-CCS20-Z CONN SOCKET PLCC 20POS TIN Assmann WSW Components	-	RFQ	데이터시트	-	Bag	Obsolete	PLCC	20 (4 x 5)	0.050" (1.27mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 105°C

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