Chipkind 전자 - IC 소켓 - Sockets for ICs, Transistors - 페이지 95 - 원본 상품 출처 - Chipkind 전자- IC 유통업체 및 전자 부품 공급업체

제조업체 부품 번호	재고 상태	가격	수량	데이터시트	시리즈	패키징	제품 상태	유형	위치 또는 핀 수(그리드)	피치 - Mating	접촉 마감 - 결합	접촉 마감 두께 - Mating	접촉 재료 - Mating	장착 유형	기능	종단	피치 - 포스트	접촉 마감 - 포스트	접촉 마감 두께 - 포스트	접촉 재료 - 포스트	하우징 소재	작동 온도
AR 06-HZW/TN SOCKET Assmann WSW Components	0	-	RFQ	데이터시트	AR	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	Flash	Phosphor Bronze	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Thermoplastic, Polyester, Glass Filled	-40°C ~ 105°C
03-0513-10 CONN SOCKET SIP 3POS GOLD Aries Electronics	0	-	RFQ	데이터시트	0513	Bulk	Active	SIP	3 (1 x 3)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
121-83-304-41-001101 CONN IC DIP SOCKET 4POS GOLD Preci-Dip	0	-	RFQ	데이터시트	121	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	4 (2 x 2)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
A-CCS028-Z-SM/P SOCKET Assmann WSW Components	0	-	RFQ	데이터시트	-	Bulk	Active	PLCC	28	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Phosphor Bronze	Polyphenylene Sulfide (PPS), Glass Filled	-40°C ~ 105°C
AR08-HZW/T CONN IC DIP SOCKET 8POS GOLD Assmann WSW Components	0	-	RFQ	데이터시트	-	Bag	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester	-40°C ~ 105°C
A-CCS20-Z-SM-R CONN SOCKET PLCC 20POS TIN Assmann WSW Components	0	-	RFQ	데이터시트	-	Tube	Obsolete	PLCC	20 (4 x 5)	0.050" (1.27mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 105°C
SU1210000000G SU-2*6P BLACK ; 10.0MM CLIP PLA Amphenol Anytek	0	-	RFQ	데이터시트	SU	Bulk	Active	DIP, 0.1" (2.54mm) Row Spacing	12 (2 x 6)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Polyphenylene Sulfide (PPS)	-40°C ~ 105°C
2-641264-1 CONN IC DIP SOCKET 20POS TIN TE Connectivity AMP Connectors	0	-	RFQ	데이터시트	Diplomate DL	Tube	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	-	Beryllium Copper	Thermoplastic, Glass Filled	-55°C ~ 105°C
110-87-610-41-001101 CONN IC DIP SOCKET 10POS GOLD Preci-Dip	0	-	RFQ	데이터시트	110	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
116-83-304-41-012101 CONN IC DIP SOCKET 4POS GOLD Preci-Dip	0	-	RFQ	데이터시트	116	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	4 (2 x 2)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
AW 127-26/Z-T SOCKET 26 CONTACTS SINGLE ROW Assmann WSW Components	0	-	RFQ	데이터시트	-	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
SIP1X14-011B SIP1X14-011B-SIP SOCKET 14 CTS Amphenol ICC (FCI)	0	-	RFQ	데이터시트	SIP1x	Bulk	Active	SIP	14 (1 x 14)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-
110-87-312-41-005101 CONN IC DIP SOCKET 12POS GOLD Preci-Dip	0	-	RFQ	데이터시트	110	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	12 (2 x 6)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
115-87-610-41-001101 CONN IC DIP SOCKET 10POS GOLD Preci-Dip	0	-	RFQ	데이터시트	115	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
BU080Z CONN IC DIP SOCKET 8POS On Shore Technology Inc.	43	-	RFQ	데이터시트	BU	Tube	Active	-	8 (2 x 4)	-	-	-	-	-	-	-	-	-	-	-	-	-
AR16-HZL/01-TT CONN IC DIP SOCKET 16POS GOLD Assmann WSW Components	0	-	RFQ	데이터시트	-	Bag	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester	-40°C ~ 105°C
A-CCS52-Z CONN SOCKET PLCC 52POS TIN Assmann WSW Components	0	-	RFQ	데이터시트	-	Bag	Obsolete	PLCC	52 (4 x 13)	0.050" (1.27mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 105°C
04-0518-10H CONN SOCKET SIP 4POS GOLD Aries Electronics	0	-	RFQ	데이터시트	518	Bulk	Active	SIP	4 (1 x 4)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
04-1518-10H CONN IC DIP SOCKET 4POS GOLD Aries Electronics	0	-	RFQ	데이터시트	518	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	4 (2 x 2)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
05-0518-10 CONN SOCKET SIP 5POS GOLD Aries Electronics	0	-	RFQ	데이터시트	518	Bulk	Active	SIP	5 (1 x 5)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-

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