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    IC 소켓

    제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    모두 초기화
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    결과
    사진 제조업체 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
    28-6518-10E

    28-6518-10E

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    0
    RFQ
    28-6518-10E

    데이터시트

    518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    12-6503-21

    12-6503-21

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    0
    RFQ
    12-6503-21

    데이터시트

    503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    12-6503-31

    12-6503-31

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    0
    RFQ
    12-6503-31

    데이터시트

    503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    APA-632-T-N

    APA-632-T-N

    ADAPTER PLUG

    Samtec Inc.

    0
    RFQ
    APA-632-T-N

    데이터시트

    APA Tube Active - 32 (2 x 16) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    299-83-628-10-002101

    299-83-628-10-002101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    0
    RFQ
    299-83-628-10-002101

    데이터시트

    299 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-148-15-062101

    510-83-148-15-062101

    CONN SOCKET PGA 148POS GOLD

    Preci-Dip

    0
    RFQ
    510-83-148-15-062101

    데이터시트

    510 Bulk Active PGA 148 (15 x 15) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    APA-648-T-A1

    APA-648-T-A1

    ADAPTER PLUG

    Samtec Inc.

    0
    RFQ
    APA-648-T-A1

    데이터시트

    APA Bulk Active - 48 (2 x 24) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    60-9513-10

    60-9513-10

    CONN IC DIP SOCKET 60POS GOLD

    Aries Electronics

    0
    RFQ
    60-9513-10

    데이터시트

    Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 60 (2 x 30) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    36-6513-11

    36-6513-11

    CONN IC DIP SOCKET 36POS GOLD

    Aries Electronics

    0
    RFQ
    36-6513-11

    데이터시트

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    ICA-316-WGG

    ICA-316-WGG

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    0
    RFQ
    ICA-316-WGG

    데이터시트

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    4-1437538-8

    4-1437538-8

    CONN IC DIP SOCKET 64POS GOLD

    TE Connectivity AMP Connectors

    0
    RFQ
    4-1437538-8

    데이터시트

    800 Tube Obsolete DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) - - - Polyester -55°C ~ 105°C
    4-1437531-9

    4-1437531-9

    CONN IC DIP SOCKET 16POS TIN

    TE Connectivity AMP Connectors

    0
    RFQ
    4-1437531-9

    데이터시트

    500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin - Copper Alloy Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin - Copper Alloy - -55°C ~ 105°C
    ICO-632-ZLGT

    ICO-632-ZLGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    0
    RFQ
    ICO-632-ZLGT

    데이터시트

    ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    APH-1910-T-H

    APH-1910-T-H

    APH-1910-T-H

    Samtec Inc.

    0
    RFQ
    APH-1910-T-H

    데이터시트

    * - Active - - - - - - - - - - - - - - -
    APH-1510-T-H

    APH-1510-T-H

    APH-1510-T-H

    Samtec Inc.

    0
    RFQ
    APH-1510-T-H

    데이터시트

    * - Active - - - - - - - - - - - - - - -
    APH-1810-T-H

    APH-1810-T-H

    APH-1810-T-H

    Samtec Inc.

    0
    RFQ
    APH-1810-T-H

    데이터시트

    * - Active - - - - - - - - - - - - - - -
    APH-0410-T-H

    APH-0410-T-H

    APH-0410-T-H

    Samtec Inc.

    0
    RFQ
    APH-0410-T-H

    데이터시트

    * - Active - - - - - - - - - - - - - - -
    APH-0810-T-H

    APH-0810-T-H

    APH-0810-T-H

    Samtec Inc.

    0
    RFQ
    APH-0810-T-H

    데이터시트

    * - Active - - - - - - - - - - - - - - -
    510-83-149-15-003101

    510-83-149-15-003101

    CONN SOCKET PGA 149POS GOLD

    Preci-Dip

    0
    RFQ
    510-83-149-15-003101

    데이터시트

    510 Bulk Active PGA 149 (15 x 15) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-149-15-061101

    510-83-149-15-061101

    CONN SOCKET PGA 149POS GOLD

    Preci-Dip

    0
    RFQ
    510-83-149-15-061101

    데이터시트

    510 Bulk Active PGA 149 (15 x 15) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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