Chipkind 전자 - IC 소켓 - Sockets for ICs, Transistors - 페이지 402 - 원본 상품 출처 - Chipkind 전자- IC 유통업체 및 전자 부품 공급업체

제조업체 부품 번호	가격	수량	데이터시트	시리즈	패키징	제품 상태	유형	위치 또는 핀 수(그리드)	피치 - Mating	접촉 마감 - 결합	접촉 마감 두께 - Mating	접촉 재료 - Mating	장착 유형	기능	종단	피치 - 포스트	접촉 마감 - 포스트	접촉 마감 두께 - 포스트	접촉 재료 - 포스트	하우징 소재	작동 온도
ICA-422-ZAGG .100" SCREW MACHINE DIP SOCKET Samtec Inc.	-	RFQ	데이터시트	ICA	Tube	Active	DIP, 0.4" (10.16mm) Row Spacing	22 (2 x 11)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Brass	Polyester, Glass Filled	-55°C ~ 125°C
510-87-262-20-091101 CONN SOCKET PGA 262POS GOLD Preci-Dip	-	RFQ	데이터시트	510	Bulk	Active	PGA	262 (20 x 20)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
ICO-422-CGT .100" LOW PROFILE SCREW MACHINE Samtec Inc.	-	RFQ	데이터시트	ICO	Tube	Active	DIP, 0.4" (10.16mm) Row Spacing	22 (2 x 11)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	10.0µin (0.25µm)	Brass	Polyester, Glass Filled	-55°C ~ 125°C
APH-1416-T-R APH-1416-T-R Samtec Inc.	-	RFQ	데이터시트	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-0916-T-R APH-0916-T-R Samtec Inc.	-	RFQ	데이터시트	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-0516-T-R APH-0516-T-R Samtec Inc.	-	RFQ	데이터시트	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-1016-T-R APH-1016-T-R Samtec Inc.	-	RFQ	데이터시트	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-0616-T-R APH-0616-T-R Samtec Inc.	-	RFQ	데이터시트	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-1116-T-R APH-1116-T-R Samtec Inc.	-	RFQ	데이터시트	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-0316-T-R APH-0316-T-R Samtec Inc.	-	RFQ	데이터시트	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-1716-T-R APH-1716-T-R Samtec Inc.	-	RFQ	데이터시트	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-0416-T-R APH-0416-T-R Samtec Inc.	-	RFQ	데이터시트	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-1616-T-R APH-1616-T-R Samtec Inc.	-	RFQ	데이터시트	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-0716-T-R APH-0716-T-R Samtec Inc.	-	RFQ	데이터시트	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-0816-T-R APH-0816-T-R Samtec Inc.	-	RFQ	데이터시트	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
16-820-90T RT ANGLE 16 PIN SKT .1 INCH CTR Aries Electronics	-	RFQ	데이터시트	Vertisockets™ 800	-	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6	105°C
28-3518-112 CONN IC DIP SOCKET 28POS GOLD Aries Electronics	-	RFQ	데이터시트	518	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
28-6518-112 CONN IC DIP SOCKET 28POS GOLD Aries Electronics	-	RFQ	데이터시트	518	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
614-87-068-10-061112 CONN SOCKET PGA 68POS GOLD Preci-Dip	-	RFQ	데이터시트	614	Bulk	Active	PGA	68 (10 x 10)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
116-83-640-41-004101 CONN IC DIP SOCKET 40POS GOLD Preci-Dip	-	RFQ	데이터시트	116	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C

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