Chipkind 전자
  • 큰 재고
  • 클라우드 가격
    Chipkind 전자 Chipkind 전자

    IC 소켓

    제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    모두 초기화
    모두 적용
    결과
    사진 제조업체 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
    346-93-133-41-013000

    346-93-133-41-013000

    CONN SOCKET SIP 33POS GOLD

    Mill-Max Manufacturing Corp.

    0
    RFQ
    346-93-133-41-013000

    데이터시트

    346 Bulk Active SIP 33 (1 x 33) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    346-43-133-41-013000

    346-43-133-41-013000

    CONN SOCKET SIP 33POS GOLD

    Mill-Max Manufacturing Corp.

    0
    RFQ
    346-43-133-41-013000

    데이터시트

    346 Bulk Active SIP 33 (1 x 33) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    38-6501-30

    38-6501-30

    CONN IC DIP SOCKET 38POS TIN

    Aries Electronics

    0
    RFQ
    38-6501-30

    데이터시트

    501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 38 (2 x 19) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    510-83-146-15-061101

    510-83-146-15-061101

    CONN SOCKET PGA 146POS GOLD

    Preci-Dip

    0
    RFQ
    510-83-146-15-061101

    데이터시트

    510 Bulk Active PGA 146 (15 x 15) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    APA-628-T-C

    APA-628-T-C

    ADAPTER PLUG

    Samtec Inc.

    0
    RFQ
    APA-628-T-C

    데이터시트

    APA Bulk Active - 28 (2 x 14) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    APO-628-T-C

    APO-628-T-C

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    0
    RFQ
    APO-628-T-C

    데이터시트

    APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    514-83-068-10-001117

    514-83-068-10-001117

    CONN SOCKET PGA 68POS GOLD

    Preci-Dip

    0
    RFQ
    514-83-068-10-001117

    데이터시트

    514 Bulk Active PGA 68 (10 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    514-83-068-10-061117

    514-83-068-10-061117

    CONN SOCKET PGA 68POS GOLD

    Preci-Dip

    0
    RFQ
    514-83-068-10-061117

    데이터시트

    514 Bulk Active PGA 68 (10 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICO-318-NGG

    ICO-318-NGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    0
    RFQ
    ICO-318-NGG

    데이터시트

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    34-3513-11

    34-3513-11

    CONN IC DIP SOCKET 34POS GOLD

    Aries Electronics

    0
    RFQ
    34-3513-11

    데이터시트

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 34 (2 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    ICA-624-WGT-2

    ICA-624-WGT-2

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    0
    RFQ
    ICA-624-WGT-2

    데이터시트

    ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICA-324-WGT-2

    ICA-324-WGT-2

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    0
    RFQ
    ICA-324-WGT-2

    데이터시트

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    HLS-0220-TT-11

    HLS-0220-TT-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    0
    RFQ
    HLS-0220-TT-11

    데이터시트

    HLS Tube Active SIP 40 (2 x 20) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
    116-87-650-41-004101

    116-87-650-41-004101

    CONN IC DIP SOCKET 50POS GOLD

    Preci-Dip

    0
    RFQ
    116-87-650-41-004101

    데이터시트

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICF-648-S-O-TR

    ICF-648-S-O-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    0
    RFQ
    ICF-648-S-O-TR

    데이터시트

    ICF Tape & Reel (TR) Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICO-320-ZNGG

    ICO-320-ZNGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    0
    RFQ
    ICO-320-ZNGG

    데이터시트

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    APA-316-T-B

    APA-316-T-B

    ADAPTER PLUG

    Samtec Inc.

    0
    RFQ
    APA-316-T-B

    데이터시트

    APA Bulk Active - 16 (2 x 8) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    12-3503-21

    12-3503-21

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    0
    RFQ
    12-3503-21

    데이터시트

    503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    12-3503-31

    12-3503-31

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    0
    RFQ
    12-3503-31

    데이터시트

    503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    ICO-640-ZSGT

    ICO-640-ZSGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    0
    RFQ
    ICO-640-ZSGT

    데이터시트

    ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    Total 19086 Record«Prev1... 400401402403404405406407...955Next»
    Chipkind 전자

    Chipkind 전자

    제품

    Chipkind 전자

    전화

    Chipkind 전자

    사용자