Chipkind 전자 - IC 소켓 - Sockets for ICs, Transistors - 페이지 557 - 원본 상품 출처 - Chipkind 전자- IC 유통업체 및 전자 부품 공급업체

제조업체 부품 번호	가격	수량	데이터시트	시리즈	패키징	제품 상태	유형	위치 또는 핀 수(그리드)	피치 - Mating	접촉 마감 - 결합	접촉 마감 두께 - Mating	접촉 재료 - Mating	장착 유형	기능	종단	피치 - 포스트	접촉 마감 - 포스트	접촉 마감 두께 - 포스트	접촉 재료 - 포스트	하우징 소재	작동 온도
116-47-328-41-006000 STANDRD SOLDRTL DBL SKT Mill-Max Manufacturing Corp.	-	RFQ	데이터시트	116	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
116-47-428-41-006000 STANDRD SOLDRTL Mill-Max Manufacturing Corp.	-	RFQ	데이터시트	116	Tube	Active	DIP, 0.4" (10.16mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
116-47-628-41-006000 STANDRD SOLDRTL Mill-Max Manufacturing Corp.	-	RFQ	데이터시트	116	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
APO-310-G-H .100" LOW PROFILE SCREW MACHINE Samtec Inc.	-	RFQ	데이터시트	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
614-41-210-41-001000 SKT CARRIER PGA Mill-Max Manufacturing Corp.	-	RFQ	데이터시트	614	Tube	Active	DIP, 0.2" (5.08mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
614-91-210-41-001000 SKT CARRIER PGA Mill-Max Manufacturing Corp.	-	RFQ	데이터시트	614	Tube	Active	DIP, 0.2" (5.08mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
116-41-324-41-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	-	RFQ	데이터시트	116	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
116-41-424-41-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	-	RFQ	데이터시트	116	Tube	Active	DIP, 0.4" (10.16mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
116-41-624-41-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	-	RFQ	데이터시트	116	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
116-91-324-41-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	-	RFQ	데이터시트	116	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
116-91-424-41-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	-	RFQ	데이터시트	116	Tube	Active	DIP, 0.4" (10.16mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
116-91-624-41-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	-	RFQ	데이터시트	116	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
410-91-216-10-001000 STANDRD SOLDRTL DBL SKT Mill-Max Manufacturing Corp.	-	RFQ	데이터시트	410	Tube	Active	Zig-Zag, Left Stackable	16 (2 x 8)	0.100" (2.54mm)	-	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
410-91-216-10-002000 STANDRD SOLDRTL DBL SKT Mill-Max Manufacturing Corp.	-	RFQ	데이터시트	410	Tube	Active	Zig-Zag, Right Stackable	16 (2 x 8)	0.100" (2.54mm)	-	-	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
30-0501-20 CONN SOCKET SIP 30POS TIN Aries Electronics	-	RFQ	데이터시트	501	Bulk	Active	SIP	30 (1 x 30)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	-	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
02-0518-00 CONN SOCKET SIP 2POS GOLD Aries Electronics	-	RFQ	데이터시트	518	Bulk	Active	SIP	2 (1 x 2)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
32-6508-202 CONN IC DIP SOCKET 32POS GOLD Aries Electronics	-	RFQ	데이터시트	508	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
115-91-428-41-003000 SOCKET IC OPEN LOWPRO .400 28POS Mill-Max Manufacturing Corp.	-	RFQ	데이터시트	115	Tube	Active	DIP, 0.4" (10.16mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Thermoplastic	-55°C ~ 125°C
614-93-314-31-018000 CONN IC DIP SOCKET 14POS GOLD Mill-Max Manufacturing Corp.	-	RFQ	데이터시트	614	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
115-41-428-41-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	-	RFQ	데이터시트	115	Tube	Active	DIP, 0.4" (10.16mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C

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