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    제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    모두 초기화
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    사진 제조업체 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
    116-43-420-41-006000

    116-43-420-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0
    RFQ
    116-43-420-41-006000

    데이터시트

    116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-41-210-31-007000

    614-41-210-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    0
    RFQ
    614-41-210-31-007000

    데이터시트

    614 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-210-31-007000

    614-91-210-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    0
    RFQ
    614-91-210-31-007000

    데이터시트

    614 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0312-T-32

    HLS-0312-T-32

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    0
    RFQ
    HLS-0312-T-32

    데이터시트

    HLS Tube Active SIP 36 (3 x 12) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    124-41-308-41-002000

    124-41-308-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0
    RFQ
    124-41-308-41-002000

    데이터시트

    124 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    124-91-308-41-002000

    124-91-308-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0
    RFQ
    124-91-308-41-002000

    데이터시트

    124 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    210-11-324-41-001000

    210-11-324-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0
    RFQ
    210-11-324-41-001000

    데이터시트

    210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    210-11-424-41-001000

    210-11-424-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0
    RFQ
    210-11-424-41-001000

    데이터시트

    210 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    210-11-624-41-001000

    210-11-624-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0
    RFQ
    210-11-624-41-001000

    데이터시트

    210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    114-93-324-41-117000

    114-93-324-41-117000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    0
    RFQ
    114-93-324-41-117000

    데이터시트

    114 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    114-93-424-41-117000

    114-93-424-41-117000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    0
    RFQ
    114-93-424-41-117000

    데이터시트

    114 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    114-93-624-41-117000

    114-93-624-41-117000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    0
    RFQ
    114-93-624-41-117000

    데이터시트

    114 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    114-43-324-41-117000

    114-43-324-41-117000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0
    RFQ
    114-43-324-41-117000

    데이터시트

    114 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    114-43-424-41-117000

    114-43-424-41-117000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0
    RFQ
    114-43-424-41-117000

    데이터시트

    114 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    114-43-624-41-117000

    114-43-624-41-117000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0
    RFQ
    114-43-624-41-117000

    데이터시트

    114 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0314-G-2

    HLS-0314-G-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    0
    RFQ
    HLS-0314-G-2

    데이터시트

    HLS Tube Active SIP 42 (3 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    ICA-648-ATT

    ICA-648-ATT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    0
    RFQ
    ICA-648-ATT

    데이터시트

    ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    14-0511-11

    14-0511-11

    CONN SOCKET SIP 14POS GOLD

    Aries Electronics

    0
    RFQ
    14-0511-11

    데이터시트

    511 Bulk Active SIP 14 (1 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    29-0501-20

    29-0501-20

    CONN SOCKET SIP 29POS TIN

    Aries Electronics

    0
    RFQ
    29-0501-20

    데이터시트

    501 Bulk Active SIP 29 (1 x 29) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    29-0501-30

    29-0501-30

    CONN SOCKET SIP 29POS TIN

    Aries Electronics

    0
    RFQ
    29-0501-30

    데이터시트

    501 Bulk Active SIP 29 (1 x 29) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    Total 19086 Record«Prev1... 550551552553554555556557...955Next»
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