Chipkind 전자 - IC 소켓 - Sockets for ICs, Transistors - 페이지 51 - 원본 상품 출처 - Chipkind 전자- IC 유통업체 및 전자 부품 공급업체

제조업체 부품 번호	재고 상태	가격	수량	데이터시트	시리즈	패키징	제품 상태	유형	위치 또는 핀 수(그리드)	피치 - Mating	접촉 마감 - 결합	접촉 마감 두께 - Mating	접촉 재료 - Mating	장착 유형	기능	종단	피치 - 포스트	접촉 마감 - 포스트	접촉 마감 두께 - 포스트	접촉 재료 - 포스트	하우징 소재	작동 온도
APA-640-G-P ADAPTER PLUG Samtec Inc.	0	-	RFQ	데이터시트	APA	Bulk	Active	-	40 (2 x 20)	0.100" (2.54mm)	Gold	20.0µin (0.51µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	20.0µin (0.51µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-
2174988-1 CONN SOCKET LGA 2011POS GOLD TE Connectivity AMP Connectors	0	-	RFQ	데이터시트	-	Bulk	Obsolete	LGA	2011 (47 x 58)	0.040" (1.02mm)	Gold	15.0µin (0.38µm)	Copper Alloy	Surface Mount	Closed Frame	Solder	0.035" (0.90mm)	Gold	15.0µin (0.38µm)	Copper Alloy	Thermoplastic	-
6-1437522-9 STAMPED PIN TE Connectivity AMP Connectors	0	-	RFQ	데이터시트	-	Bulk	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
523-93-121-13-061001 PGA SOCK 121PIN 13X13 WIRE WRAP Mill-Max Manufacturing Corp.	295	-	RFQ	데이터시트	523	Bulk	Active	PGA	121 (13 x 13)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	-	Through Hole	-	Wire Wrap	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	-	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-
21218NE CONN IC DIP SOCKET 8POS Marutsuelec	2,268	-	RFQ	데이터시트	-	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	-	-	-	Through Hole	Open Frame	-	0.100" (2.54mm)	-	-	-	-	-40°C ~ 105°C
212014NE CONN IC DIP SOCKET 14POS Marutsuelec Co., Ltd.	1,214	-	RFQ	데이터시트	-	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	-	-	-	Through Hole	Open Frame	-	0.100" (2.54mm)	-	-	-	-	-30°C ~ 85°C
212016NE CONN IC DIP SOCKET 16POS Marutsuelec Co., Ltd.	1,364	-	RFQ	데이터시트	-	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	-	-	-	Through Hole	Open Frame	-	0.100" (2.54mm)	-	-	-	-	-30°C ~ 85°C
212024WE CONN IC DIP SOCKET 24POS Marutsuelec Co., Ltd.	1,892	-	RFQ	데이터시트	-	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	-	-	-	Through Hole	Open Frame	-	0.100" (2.54mm)	-	-	-	-	-30°C ~ 85°C
212114NE CONN IC DIP SOCKET 14POS Marutsuelec	1,559	-	RFQ	데이터시트	-	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	-	-	-	Through Hole	Open Frame	-	0.100" (2.54mm)	-	-	-	-	-40°C ~ 105°C
212116NE CONN IC DIP SOCKET 16POS Marutsuelec	1,764	-	RFQ	데이터시트	-	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	-	-	-	Through Hole	Open Frame	-	0.100" (2.54mm)	-	-	-	-	-40°C ~ 105°C
212124NE CONN IC DIP SOCKET 24POS Marutsuelec	489	-	RFQ	데이터시트	-	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	-	-	-	Through Hole	Open Frame	-	0.100" (2.54mm)	-	-	-	-	-40°C ~ 105°C
212128NE CONN IC DIP SOCKET 28POS Marutsuelec	1,023	-	RFQ	데이터시트	-	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	-	-	-	Through Hole	Open Frame	-	0.100" (2.54mm)	-	-	-	-	-40°C ~ 105°C
212132WE CONN IC DIP SOCKET 32POS Marutsuelec	575	-	RFQ	데이터시트	-	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	-	-	-	Through Hole	Open Frame	-	0.100" (2.54mm)	-	-	-	-	-40°C ~ 105°C
212140WE CONN IC DIP SOCKET 40POS Marutsuelec	216	-	RFQ	데이터시트	-	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	-	-	-	Through Hole	Open Frame	-	0.100" (2.54mm)	-	-	-	-	-40°C ~ 105°C
2-1571552-6 820-AG11D-ESL-LF=800 DIP GF/SN TE Connectivity AMP Connectors	2,010	-	RFQ	데이터시트	800	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	180.0µin (4.57µm)	Copper	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 105°C
820-AG11D-ESL-LF IC SOCKET, DIP20, 20 CONTACT(S), TE Connectivity AMP Connectors	2,010	-	RFQ	데이터시트	800	Bulk	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	180.0µin (4.57µm)	Copper	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 105°C
3-1571552-2 840-AG11D-ESL-LF=800 DIP GF/SN TE Connectivity AMP Connectors	5,833	-	RFQ	데이터시트	800	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	40	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	Flash	Copper	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 105°C
840-AG11D-ESL-LF IC SOCKET, DIP40, 40 CONTACT(S), TE Connectivity AMP Connectors	5,833	-	RFQ	데이터시트	800	Bulk	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	40	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	Flash	Copper	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 105°C
110-87-210-41-001101 CONN IC DIP SOCKET 10POS GOLD Preci-Dip	416	-	RFQ	데이터시트	110	Tube	Active	DIP, 0.2" (5.08mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
SA203000 CONN IC DIP SOCKET 20POS GOLD On Shore Technology Inc.	645	-	RFQ	데이터시트	SA	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Thermoplastic, Polyester, Glass Filled	-40°C ~ 105°C

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