Chipkind 전자 - IC 소켓 - Sockets for ICs, Transistors - 페이지 47 - 원본 상품 출처 - Chipkind 전자- IC 유통업체 및 전자 부품 공급업체

제조업체 부품 번호	재고 상태	가격	수량	데이터시트	시리즈	패키징	제품 상태	유형	위치 또는 핀 수(그리드)	피치 - Mating	접촉 마감 - 결합	접촉 마감 두께 - Mating	접촉 재료 - Mating	장착 유형	기능	종단	피치 - 포스트	접촉 마감 - 포스트	접촉 마감 두께 - 포스트	접촉 재료 - 포스트	하우징 소재	작동 온도
8080-1G24 CONN SOCKET TRANSIST TO-3 3POS TE Connectivity AMP Connectors	380	-	RFQ	데이터시트	-	Bulk	Obsolete	Transistor, TO-3	3 (Round)	-	Tin-Lead	20.0µin (0.51µm)	Beryllium Copper	Chassis Mount	Closed Frame	Solder	-	Tin-Lead	20.0µin (0.51µm)	Beryllium Copper	Diallyl Phthalate (DAP)	-55°C ~ 125°C
2013620-3 CONN SOCKET PGA ZIF 989POS GOLD TE Connectivity AMP Connectors	0	-	RFQ	데이터시트	-	Tape & Reel (TR)	Active	PGA, ZIF (ZIP)	989 (35 x 36)	0.039" (1.00mm)	Gold	15.0µin (0.38µm)	Copper Alloy	Surface Mount	Open Frame	Solder	0.039" (1.00mm)	-	-	Copper Alloy	Thermoplastic	-
ICO-324-MGT 100" LOW PROFILE SCREW MACHINE D Samtec Inc.	0	-	RFQ	데이터시트	ICO	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	10.0µin (0.25µm)	Brass	Polyester, Glass Filled	-55°C ~ 125°C
ICA-324-SGG .100" SCREW MACHINE DIP SOCKET Samtec Inc.	0	-	RFQ	데이터시트	ICA	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Brass	Polyester, Glass Filled	-55°C ~ 125°C
123-43-624-41-801000 CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp.	167	-	RFQ	데이터시트	123	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame, Decoupling Capacitor	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
ICO-316-NGG .100" LOW PROFILE SCREW MACHINE Samtec Inc.	0	-	RFQ	데이터시트	ICO	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Brass	Polyester, Glass Filled	-55°C ~ 125°C
9-1437504-0 CONN TRANSIST TO-3 3POS TIN TE Connectivity AMP Connectors	0	-	RFQ	데이터시트	8080	Bulk	Obsolete	Transistor, TO-3	3 (Oval)	-	Tin	200.0µin (5.08µm)	Beryllium Copper	Chassis Mount	Closed Frame	Solder	-	Tin	200.0µin (5.08µm)	Beryllium Copper	Polytetrafluoroethylene (PTFE)	-55°C ~ 125°C
8059-2G9 CONN TRANSIST TO-5 10POS GOLD TE Connectivity AMP Connectors	0	-	RFQ	데이터시트	8059	Bulk	Obsolete	Transistor, TO-5	10 (Round)	-	Gold	-	Copper Alloy	Through Hole	-	Solder	-	Gold	-	Copper Alloy	Polyamide (PA), Nylon, Glass Filled	-55°C ~ 125°C
ICF-324-S-O .100" SURFACE MOUNT SCREW MACHIN Samtec Inc.	0	-	RFQ	데이터시트	ICF	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Beryllium Copper	Liquid Crystal Polymer (LCP)	-55°C ~ 125°C
ICF-624-S-O .100" SURFACE MOUNT SCREW MACHIN Samtec Inc.	0	-	RFQ	데이터시트	ICF	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Beryllium Copper	Liquid Crystal Polymer (LCP)	-55°C ~ 125°C
ICO-628-MGT CONN IC DIP SOCKET 28POS GOLD Samtec Inc.	0	-	RFQ	데이터시트	ICO	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	10.0µin (0.25µm)	Brass	Polyester, Glass Filled	-55°C ~ 125°C
ICF-624-S-O-TR .100" SURFACE MOUNT SCREW MACHIN Samtec Inc.	0	-	RFQ	데이터시트	ICF	Tape & Reel (TR)	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Beryllium Copper	Liquid Crystal Polymer (LCP)	-55°C ~ 125°C
ICA-324-ZAGT .100" SCREW MACHINE DIP SOCKET Samtec Inc.	0	-	RFQ	데이터시트	ICA	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	10.0µin (0.25µm)	Brass	Polyester, Glass Filled	-55°C ~ 125°C
ICO-628-SGG .100" LOW PROFILE SCREW MACHINE Samtec Inc.	0	-	RFQ	데이터시트	ICO	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Brass	Polyester, Glass Filled	-55°C ~ 125°C
8080-1G14 CONN SOCKET TRANSIST TO-3 3POS TE Connectivity AMP Connectors	0	-	RFQ	데이터시트	8080	Bulk	Obsolete	Transistor, TO-3	3 (Oval)	-	Tin-Lead	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Tin-Lead	-	Beryllium Copper	Phenolic	-55°C ~ 125°C
3-1437504-2 3-1437504-2 TE Connectivity AMP Connectors	130	-	RFQ	데이터시트	8080	Box	Active	Transistor, TO-3	3 (Oval)	-	Tin-Lead	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Tin-Lead	-	Beryllium Copper	Phenolic	-55°C ~ 125°C
ICO-320-NGG .100" LOW PROFILE SCREW MACHINE Samtec Inc.	0	-	RFQ	데이터시트	ICO	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Brass	Polyester, Glass Filled	-55°C ~ 125°C
117-43-668-41-005000 CONN IC DIP SOCKET 68POS GOLD Mill-Max Manufacturing Corp.	198	-	RFQ	데이터시트	117	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	68 (2 x 34)	0.070" (1.78mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.070" (1.78mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
2040540-1 CONN SOCKET LGA 1156POS GOLD TE Connectivity AMP Connectors	0	-	RFQ	데이터시트	-	Tray	Active	LGA	1156 (34 x 34)	0.036" (0.91mm)	Gold	15.0µin (0.38µm)	Copper Alloy	Surface Mount	Closed Frame	Solder	0.039" (1.00mm)	-	-	Copper Alloy	Thermoplastic	-
ICF-628-S-O .100" SURFACE MOUNT SCREW MACHIN Samtec Inc.	0	-	RFQ	데이터시트	ICF	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Beryllium Copper	Liquid Crystal Polymer (LCP)	-55°C ~ 125°C

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