Chipkind 전자 - IC 소켓 - Sockets for ICs, Transistors - 페이지 41 - 원본 상품 출처 - Chipkind 전자- IC 유통업체 및 전자 부품 공급업체

제조업체 부품 번호	재고 상태	가격	수량	데이터시트	시리즈	패키징	제품 상태	유형	위치 또는 핀 수(그리드)	피치 - Mating	접촉 마감 - 결합	접촉 마감 두께 - Mating	접촉 재료 - Mating	장착 유형	기능	종단	피치 - 포스트	접촉 마감 - 포스트	접촉 마감 두께 - 포스트	접촉 재료 - 포스트	하우징 소재	작동 온도
APO-308-T-H .100" LOW PROFILE SCREW MACHINE Samtec Inc.	0	-	RFQ	데이터시트	APO	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-
2-1571550-8 CONN IC DIP SOCKET 24POS GOLD TE Connectivity AMP Connectors	0	-	RFQ	데이터시트	500	Tube	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	25.0µin (0.63µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	25.0µin (0.63µm)	Beryllium Copper	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
524-AG11D CONN IC DIP SOCKET 24POS GOLD TE Connectivity AMP Connectors	1,444	-	RFQ	데이터시트	500	Tube	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	25.0µin (0.63µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	-	-	Brass	Polyester	-55°C ~ 125°C
2-1571586-4 CONN IC DIP SOCKET 16POS GOLD TE Connectivity AMP Connectors	0	-	RFQ	데이터시트	800	Bulk	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	25.0µin (0.63µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	25.0µin (0.63µm)	Copper	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 105°C
2-1571551-9 CONN IC DIP SOCKET 28POS GOLD TE Connectivity AMP Connectors	0	-	RFQ	데이터시트	500	Tube	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	Flash	Nickel	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
524-AG11D-ESL CONN IC DIP SOCKET 24POS GOLD TE Connectivity AMP Connectors	259	-	RFQ	데이터시트	500	Tube	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	5.00µin (0.127µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	-	-	Brass	-	-55°C ~ 125°C
ICO-308-LTT CONN IC DIP SOCKET 8POS TIN Samtec Inc.	0	-	RFQ	데이터시트	ICO	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polyester, Glass Filled	-55°C ~ 105°C
ICF-308-T-I .100" SURFACE MOUNT SCREW MACHIN Samtec Inc.	0	-	RFQ	데이터시트	ICF	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Beryllium Copper	Liquid Crystal Polymer (LCP)	-55°C ~ 125°C
APO-314-T-A .100" LOW PROFILE SCREW MACHINE Samtec Inc.	0	-	RFQ	데이터시트	APO	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-
1-1825376-3 CONN IC DIP SOCKET 40POS GOLD TE Connectivity AMP Connectors	0	-	RFQ	데이터시트	Diplomate DL	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Thermoplastic, Glass Filled	-55°C ~ 125°C
ICO-308-MTT .100" LOW PROFILE SCREW MACHINE Samtec Inc.	0	-	RFQ	데이터시트	ICO	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polyester, Glass Filled	-55°C ~ 105°C
ICA-314-STT .100" SCREW MACHINE DIP SOCKET Samtec Inc.	0	-	RFQ	데이터시트	ICA	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polyester, Glass Filled	-55°C ~ 105°C
ICF-308-TM-O-TR .100" SURFACE MOUNT SCREW MACHIN Samtec Inc.	0	-	RFQ	데이터시트	ICF	Tape & Reel (TR)	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Beryllium Copper	Liquid Crystal Polymer (LCP)	-55°C ~ 125°C
808-AG10D CONN IC DIP SOCKET 8POS GOLD TE Connectivity AMP Connectors	0	-	RFQ	데이터시트	800	Tube	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	25.0µin (0.63µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	5.00µin (0.127µm)	Copper Alloy	Polyester	-55°C ~ 105°C
820-AG11D CONN IC DIP SOCKET 20POS GOLD TE Connectivity AMP Connectors	0	-	RFQ	데이터시트	800	Tube	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	25.0µin (0.63µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	-	Copper Alloy	Polyester	-55°C ~ 105°C
6-1437537-6 6-1437537-6 TE Connectivity AMP Connectors	9,007	-	RFQ	데이터시트	*	Box	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
2134928-2 CONN SOCKET LGA 1150POS GOLD TE Connectivity AMP Connectors	0	-	RFQ	데이터시트	-	Bulk	Obsolete	LGA	1150	0.036" (0.91mm)	Gold	3.90µin (0.099µm)	Copper Alloy	Surface Mount	Closed Frame	Solder	0.036" (0.91mm)	-	-	-	Thermoplastic	-
1-1814655-3 CONN SOCKET SIP 20POS GOLD TE Connectivity AMP Connectors	0	-	RFQ	데이터시트	-	Bulk	Obsolete	SIP	20 (1 x 20)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Brass	Thermoplastic, Polyester	-55°C ~ 125°C
ICO-308-SST .100" LOW PROFILE SCREW MACHINE Samtec Inc.	0	-	RFQ	데이터시트	ICO	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polyester, Glass Filled	-55°C ~ 125°C
2-1571586-8 CONN IC DIP SOCKET 24POS GOLD TE Connectivity AMP Connectors	0	-	RFQ	데이터시트	800	Tube	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	25.0µin (0.63µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	25.0µin (0.63µm)	Copper	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 105°C

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