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    IC 소켓

    제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    모두 초기화
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    결과
    사진 제조업체 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
    520-AG11D-ES

    520-AG11D-ES

    DIP SOCKET T/H 20POS

    TE Connectivity AMP Connectors

    0
    RFQ
    520-AG11D-ES

    데이터시트

    500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold - Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead - Copper Alloy Polyester -55°C ~ 105°C
    50950-0084N-002

    50950-0084N-002

    1.27MM PITCH WINBOND SOCKET CONN

    Aces Connectors

    775
    RFQ
    50950-0084N-002

    데이터시트

    50950 Cut Tape (CT) Active PLCC 8 0.050" (1.27mm) Tin 80.0µin (2.03µm) Copper Alloy Surface Mount - Solder 0.050" (1.27mm) Tin 80.0µin (2.03µm) Copper Alloy Thermoplastic -
    110-83-320-41-001101

    110-83-320-41-001101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    456
    RFQ
    110-83-320-41-001101

    데이터시트

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    1-1825376-2

    1-1825376-2

    CONN IC DIP SOCKET 28POS GOLD

    TE Connectivity AMP Connectors

    0
    RFQ
    1-1825376-2

    데이터시트

    Diplomate DL Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 125°C
    1-1571552-0

    1-1571552-0

    CONN IC DIP SOCKET 32POS TIN

    TE Connectivity AMP Connectors

    0
    RFQ
    1-1571552-0

    데이터시트

    800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
    4-1571552-6

    4-1571552-6

    CONN IC DIP SOCKET 20POS GOLD

    TE Connectivity AMP Connectors

    0
    RFQ
    4-1571552-6

    데이터시트

    800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
    346-93-109-41-013000

    346-93-109-41-013000

    CONN SOCKET SIP 9POS GOLD

    Mill-Max Manufacturing Corp.

    175
    RFQ
    346-93-109-41-013000

    데이터시트

    346 Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APA-308-T-A

    APA-308-T-A

    ADAPTER PLUG

    Samtec Inc.

    0
    RFQ
    APA-308-T-A

    데이터시트

    APA Bulk Active - 8 (2 x 4) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    APO-308-T-A

    APO-308-T-A

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    0
    RFQ
    APO-308-T-A

    데이터시트

    APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    714-43-204-31-018000

    714-43-204-31-018000

    CONN IC DIP SOCKET 4POS GOLD

    Mill-Max Manufacturing Corp.

    1,545
    RFQ
    714-43-204-31-018000

    데이터시트

    714 Bulk Active DIP, 0.1" (2.54mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    2-1571551-6

    2-1571551-6

    CONN IC DIP SOCKET 20POS GOLD

    TE Connectivity AMP Connectors

    0
    RFQ
    2-1571551-6

    데이터시트

    500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Copper Alloy Polyester -55°C ~ 125°C
    824-AG31D-ES

    824-AG31D-ES

    CONN IC DIP SOCKET 24POS TINLEAD

    TE Connectivity AMP Connectors

    0
    RFQ
    824-AG31D-ES

    데이터시트

    800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin-Lead - Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead - Copper Alloy Polyester -55°C ~ 105°C
    516-AG10D-ES

    516-AG10D-ES

    CONN IC DIP SOCKET 16POS GOLD

    TE Connectivity AMP Connectors

    0
    RFQ
    516-AG10D-ES

    데이터시트

    500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) - - Brass - -55°C ~ 125°C
    828-AG11D-ES

    828-AG11D-ES

    CONN IC DIP SOCKET 28POS GOLD

    TE Connectivity AMP Connectors

    0
    RFQ
    828-AG11D-ES

    데이터시트

    800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead - Copper Alloy Polyester -55°C ~ 105°C
    9-1437539-1

    9-1437539-1

    828-AG11D-ES=SOCKET ASSY

    TE Connectivity AMP Connectors

    1,245
    RFQ
    9-1437539-1

    데이터시트

    800 Box Active DIP, 0.1" (2.54mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole - Solder 0.100" (2.54mm) - - - Polyester -55°C ~ 105°C
    210-43-316-41-001

    210-43-316-41-001

    SOCKET 16-PIN .100" X .300" MACH

    Mill-Max Manufacturing Corp.

    411
    RFQ
    210-43-316-41-001

    데이터시트

    210 Box Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    SMPX-84LCC-P

    SMPX-84LCC-P

    SMT PLCC SOCKET 84P POLARISED RO

    Kycon, Inc.

    195
    RFQ
    SMPX-84LCC-P

    데이터시트

    SMPX Tube Active PLCC 84 (4 x 21) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Board Guide, Closed Frame Solder 0.050" (1.27mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled -50°C ~ 105°C
    714-43-108-31-018000

    714-43-108-31-018000

    CONN SOCKET SIP 8POS GOLD

    Mill-Max Manufacturing Corp.

    646
    RFQ
    714-43-108-31-018000

    데이터시트

    714 Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    816-AG11D

    816-AG11D

    CONN IC DIP SOCKET 16POS GOLD

    TE Connectivity AMP Connectors

    0
    RFQ
    816-AG11D

    데이터시트

    800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) - - - Polyester -55°C ~ 105°C
    1-1437540-7

    1-1437540-7

    CONN IC DIP SOCKET 40POS GOLD

    TE Connectivity AMP Connectors

    0
    RFQ
    1-1437540-7

    데이터시트

    800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 5.00µin (0.127µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) - - - Polyester -55°C ~ 105°C
    Total 19086 Record«Prev1... 3637383940414243...955Next»
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