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    홈 > 제품  > 커넥터, 상호 연결 > IC, 트랜지스터용 소켓 > IC 소켓

    IC 소켓

    제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    모두 초기화
    모두 적용
    결과
    사진 제조업체 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
    10-7500-10

    10-7500-10

    CONN SOCKET SIP 10POS TIN

    Aries Electronics

    		 0
    RFQ
    		10-7500-10

    데이터시트

         		700 Elevator Strip-Line™ Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-7550-10

    10-7550-10

    CONN SOCKET SIP 10POS TIN

    Aries Electronics

    		 0
    RFQ
    		10-7550-10

    데이터시트

         		700 Elevator Strip-Line™ Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-7560-10

    10-7560-10

    CONN SOCKET SIP 10POS TIN

    Aries Electronics

    		 0
    RFQ
    		10-7560-10

    데이터시트

         		700 Elevator Strip-Line™ Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-7600-10

    10-7600-10

    CONN SOCKET SIP 10POS TIN

    Aries Electronics

    		 0
    RFQ
    		10-7600-10

    데이터시트

         		700 Elevator Strip-Line™ Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-7775-10

    10-7775-10

    CONN SOCKET SIP 10POS TIN

    Aries Electronics

    		 0
    RFQ
    		10-7775-10

    데이터시트

         		700 Elevator Strip-Line™ Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-7860-10

    10-7860-10

    CONN SOCKET SIP 10POS TIN

    Aries Electronics

    		 0
    RFQ
    		10-7860-10

    데이터시트

         		700 Elevator Strip-Line™ Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-7925-10

    10-7925-10

    CONN SOCKET SIP 10POS TIN

    Aries Electronics

    		 0
    RFQ
    		10-7925-10

    데이터시트

         		700 Elevator Strip-Line™ Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-4810-90C

    10-4810-90C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    		 0
    RFQ
    		10-4810-90C

    데이터시트

         		Vertisockets™ 800 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    10-6810-90C

    10-6810-90C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    		 0
    RFQ
    		10-6810-90C

    데이터시트

         		Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    ICO-632-ZSGT

    ICO-632-ZSGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    		 0
    RFQ
    		ICO-632-ZSGT

    데이터시트

         		ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    116-83-432-41-013101

    116-83-432-41-013101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    		 0
    RFQ
    		116-83-432-41-013101

    데이터시트

         		116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0404-T-10

    HLS-0404-T-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    		 0
    RFQ
    		HLS-0404-T-10

    데이터시트

         		HLS Bulk Active SIP 16 (4 x 4) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    550-80-068-10-061101

    550-80-068-10-061101

    PGA SOLDER TAIL

    Preci-Dip

    		 0
    RFQ
    		550-80-068-10-061101

    데이터시트

         		550 Bulk Active PGA 68 (10 x 10) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    840-AG11D

    840-AG11D

    CONN IC DIP SOCKET 40POS GOLD

    TE Connectivity AMP Connectors

    		 0
    RFQ
    		840-AG11D

    데이터시트

         		800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead - Copper Alloy Polyester -55°C ~ 105°C
    20-3501-21

    20-3501-21

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    		 0
    RFQ
    		20-3501-21

    데이터시트

         		501 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    20-3501-31

    20-3501-31

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    		 0
    RFQ
    		20-3501-31

    데이터시트

         		501 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    36-6501-20

    36-6501-20

    CONN IC DIP SOCKET 36POS TIN

    Aries Electronics

    		 0
    RFQ
    		36-6501-20

    데이터시트

         		501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    36-6501-30

    36-6501-30

    CONN IC DIP SOCKET 36POS TIN

    Aries Electronics

    		 0
    RFQ
    		36-6501-30

    데이터시트

         		501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    40-1518-11H

    40-1518-11H

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    		 0
    RFQ
    		40-1518-11H

    데이터시트

         		518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    HLS-0213-T-30

    HLS-0213-T-30

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    		 0
    RFQ
    		HLS-0213-T-30

    데이터시트

         		HLS Tube Active SIP 26 (2 x 13) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
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