Chipkind 전자
  • 큰 재고
  • 클라우드 가격
    Chipkind 전자 Chipkind 전자

    IC 소켓

    제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    모두 초기화
    모두 적용
    결과
    사진 제조업체 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
    714-43-120-31-018000

    714-43-120-31-018000

    CONN SOCKET SIP 20POS GOLD

    Mill-Max Manufacturing Corp.

    0
    RFQ
    714-43-120-31-018000

    데이터시트

    714 Tube Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0406-TT-10

    HLS-0406-TT-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    0
    RFQ
    HLS-0406-TT-10

    데이터시트

    HLS Bulk Active SIP 24 (4 x 6) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
    ICA-318-ZSGG

    ICA-318-ZSGG

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    0
    RFQ
    ICA-318-ZSGG

    데이터시트

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    117-83-664-41-105101

    117-83-664-41-105101

    CONN IC DIP SOCKET 64POS GOLD

    Preci-Dip

    0
    RFQ
    117-83-664-41-105101

    데이터시트

    117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 64 (2 x 32) 0.070" (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    117-83-764-41-105101

    117-83-764-41-105101

    CONN IC DIP SOCKET 64POS GOLD

    Preci-Dip

    0
    RFQ
    117-83-764-41-105101

    데이터시트

    117 Bulk Active DIP, 0.75" (19.05mm) Row Spacing 64 (2 x 32) 0.070" (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    APH-0508-T-T

    APH-0508-T-T

    APH-0508-T-T

    Samtec Inc.

    0
    RFQ
    APH-0508-T-T

    데이터시트

    * - Active - - - - - - - - - - - - - - -
    APH-1008-T-T

    APH-1008-T-T

    APH-1008-T-T

    Samtec Inc.

    0
    RFQ
    APH-1008-T-T

    데이터시트

    * - Active - - - - - - - - - - - - - - -
    APH-0608-T-T

    APH-0608-T-T

    APH-0608-T-T

    Samtec Inc.

    0
    RFQ
    APH-0608-T-T

    데이터시트

    * - Active - - - - - - - - - - - - - - -
    APH-1108-T-T

    APH-1108-T-T

    APH-1108-T-T

    Samtec Inc.

    0
    RFQ
    APH-1108-T-T

    데이터시트

    * - Active - - - - - - - - - - - - - - -
    APH-1408-T-T

    APH-1408-T-T

    APH-1408-T-T

    Samtec Inc.

    0
    RFQ
    APH-1408-T-T

    데이터시트

    * - Active - - - - - - - - - - - - - - -
    APH-1208-T-T

    APH-1208-T-T

    APH-1208-T-T

    Samtec Inc.

    0
    RFQ
    APH-1208-T-T

    데이터시트

    * - Active - - - - - - - - - - - - - - -
    APH-0308-T-T

    APH-0308-T-T

    APH-0308-T-T

    Samtec Inc.

    0
    RFQ
    APH-0308-T-T

    데이터시트

    * - Active - - - - - - - - - - - - - - -
    14-C195-00

    14-C195-00

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    0
    RFQ
    14-C195-00

    데이터시트

    EJECT-A-DIP™ Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-C280-00

    14-C280-00

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    0
    RFQ
    14-C280-00

    데이터시트

    EJECT-A-DIP™ Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-820-90TWR

    14-820-90TWR

    CONN IC DIP SOCKET 14POS TIN

    Aries Electronics

    0
    RFQ
    14-820-90TWR

    데이터시트

    Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    APA-422-T-A

    APA-422-T-A

    ADAPTER PLUG

    Samtec Inc.

    0
    RFQ
    APA-422-T-A

    데이터시트

    APA Bulk Active - 22 (2 x 11) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    116-87-640-41-004101

    116-87-640-41-004101

    CONN IC DIP SOCKET 40POS GOLD

    Preci-Dip

    0
    RFQ
    116-87-640-41-004101

    데이터시트

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-120-13-001101

    510-83-120-13-001101

    CONN SOCKET PGA 120POS GOLD

    Preci-Dip

    0
    RFQ
    510-83-120-13-001101

    데이터시트

    510 Bulk Active PGA 120 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-120-13-061101

    510-83-120-13-061101

    CONN SOCKET PGA 120POS GOLD

    Preci-Dip

    0
    RFQ
    510-83-120-13-061101

    데이터시트

    510 Bulk Active PGA 120 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICO-316-ZNGG

    ICO-316-ZNGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    0
    RFQ
    ICO-316-ZNGG

    데이터시트

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    Total 19086 Record«Prev1... 353354355356357358359360...955Next»
    Chipkind 전자

    Chipkind 전자

    제품

    Chipkind 전자

    전화

    Chipkind 전자

    사용자