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IC 소켓
| 사진 | 제조업체 부품 번호 | 재고 상태 | 수량 | 데이터시트 | 시리즈 | 패키징 | 제품 상태 | 유형 | 위치 또는 핀 수(그리드) | 피치 - Mating | 접촉 마감 - 결합 | 접촉 마감 두께 - Mating | 접촉 재료 - Mating | 장착 유형 | 기능 | 종단 | 피치 - 포스트 | 접촉 마감 - 포스트 | 접촉 마감 두께 - 포스트 | 접촉 재료 - 포스트 | 하우징 소재 | 작동 온도 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
APH-0604-G-TAPH-0604-G-T |
0 |
|
데이터시트 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-1806-T-RAPH-1806-T-R |
0 |
|
데이터시트 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-1406-T-RAPH-1406-T-R |
0 |
|
데이터시트 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-0804-G-TAPH-0804-G-T |
0 |
|
데이터시트 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-0806-T-RAPH-0806-T-R |
0 |
|
데이터시트 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-1804-G-TAPH-1804-G-T |
0 |
|
데이터시트 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-1704-G-TAPH-1704-G-T |
0 |
|
데이터시트 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-0404-G-TAPH-0404-G-T |
0 |
|
데이터시트 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
31-0518-11HCONN SOCKET SIP 31POS GOLD |
0 |
|
데이터시트 |
518 | Bulk | Active | SIP | 31 (1 x 31) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
|
|
510-87-181-17-082101CONN SOCKET PGA 181POS GOLD |
0 |
|
데이터시트 |
510 | Bulk | Active | PGA | 181 (17 x 17) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
31-0511-10CONN SOCKET SIP 31POS TIN |
0 |
|
데이터시트 |
511 | Bulk | Active | SIP | 31 (1 x 31) | 0.100" (2.54mm) | Tin | 50.0µin (1.27µm) | Phosphor Bronze | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | 50.0µin (1.27µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
|
116-47-304-41-006000STANDRD SOLDRTL DBL SKT |
0 |
|
데이터시트 |
116 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 4 (2 x 2) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
ICO-320-ZSGG.100" LOW PROFILE SCREW MACHINE |
0 |
|
데이터시트 |
ICO | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Brass | Polyester, Glass Filled | -55°C ~ 125°C |
|
|
347843-5CONN IC DIP SOCKET 10POS TINLEAD |
0 |
|
데이터시트 |
- | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 10 (2 x 5) | 0.100" (2.54mm) | Tin-Lead | - | Beryllium Copper | Through Hole, Right Angle, Horizontal | - | Solder | 0.100" (2.54mm) | Tin-Lead | - | Beryllium Copper | - | - |
|
|
MVAS-114-ZSGT-13CONN SOCKET PGA 114POS GOLD |
0 |
|
데이터시트 |
MVAS | Tube | Obsolete | PGA | 114 (13 x 13) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | - | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | - | - | - |
|
|
19-0508-20CONN SOCKET SIP 19POS GOLD |
0 |
|
데이터시트 |
508 | Bulk | Active | SIP | 19 (1 x 19) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 | -55°C ~ 105°C |
|
|
19-0508-30CONN SOCKET SIP 19POS GOLD |
0 |
|
데이터시트 |
508 | Bulk | Active | SIP | 19 (1 x 19) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 | -55°C ~ 105°C |
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|
346-93-124-41-013000CONN SOCKET SIP 24POS GOLD |
0 |
|
데이터시트 |
346 | Tube | Active | SIP | 24 (1 x 24) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Press-Fit | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
346-43-124-41-013000CONN SOCKET SIP 24POS GOLD |
0 |
|
데이터시트 |
346 | Bulk | Active | SIP | 24 (1 x 24) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Press-Fit | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
HIC-764-SSTCONN IC DIP SOCKET 64POS GOLD |
0 |
|
데이터시트 |
HIC | Tube | Obsolete | DIP, 0.75" (19.05mm) Row Spacing | 64 (2 x 32) | 0.070" (1.78mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.070" (1.78mm) | Gold | 200.0µin (5.08µm) | Brass | Polyester, Glass Filled | - |
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