Chipkind 전자 - IC 소켓 - Sockets for ICs, Transistors - 페이지 34 - 원본 상품 출처 - Chipkind 전자- IC 유통업체 및 전자 부품 공급업체

제조업체 부품 번호	재고 상태	가격	수량	데이터시트	시리즈	패키징	제품 상태	유형	위치 또는 핀 수(그리드)	피치 - Mating	접촉 마감 - 결합	접촉 마감 두께 - Mating	접촉 재료 - Mating	장착 유형	기능	종단	피치 - 포스트	접촉 마감 - 포스트	접촉 마감 두께 - 포스트	접촉 재료 - 포스트	하우징 소재	작동 온도
110-83-316-10-003101 CONN IC DIP SOCKET 16POS GOLD Preci-Dip	2,664	-	RFQ	데이터시트	110	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8), 8 Loaded	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
2445893-3 DIP IC SOCKET 20P SMT TE Connectivity AMP Connectors	3,000	-	RFQ	데이터시트	-	Tape & Reel (TR)	Active	DIP, 0.3" (7.62mm) Row Spacing	20	0.100" (2.54mm)	Tin	196.9µin (5.00µm)	Copper Alloy	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	78.7µin (2.00µm)	Copper Alloy	Thermoplastic	-55°C ~ 125°C
D2608-42 CONN IC DIP SOCKET 8POS GOLD Harwin Inc.	2,312	-	RFQ	데이터시트	D26	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100" (2.54mm)	Tin	196.9µin (5.00µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
2485264-4 DIP IC SOCKET 18P,GOLD FLASH TE Connectivity AMP Connectors	5,280	-	RFQ	데이터시트	-	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	18	0.100" (2.54mm)	Gold	Flash	Copper Alloy	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	78.7µin (2.00µm)	Copper Alloy	Thermoplastic	-55°C ~ 125°C
2445893-2 DIP IC SOCKET 16P SMT TE Connectivity AMP Connectors	3,000	-	RFQ	데이터시트	-	Tape & Reel (TR)	Active	DIP, 0.3" (7.62mm) Row Spacing	16	0.100" (2.54mm)	Tin	196.9µin (5.00µm)	Copper Alloy	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	78.7µin (2.00µm)	Copper Alloy	Thermoplastic	-55°C ~ 125°C
ICO-308-STT CONN IC DIP SOCKET 8POS TIN Samtec Inc.	111	-	RFQ	데이터시트	ICO	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polyester, Glass Filled	-55°C ~ 105°C
2485264-7 DIP IC SOCKET 28P,GOLD FLASH TE Connectivity AMP Connectors	3,822	-	RFQ	데이터시트	-	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	28	0.100" (2.54mm)	Gold	Flash	Copper Alloy	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	78.7µin (2.00µm)	Copper Alloy	Thermoplastic	-55°C ~ 125°C
116-83-314-41-006101 CONN IC DIP SOCKET 14POS GOLD Preci-Dip	2,396	-	RFQ	데이터시트	116	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
SMPX-52LCC-P SMT PLCC SOCKET 52P POLARISED RO Kycon, Inc.	203	-	RFQ	데이터시트	SMPX	Tube	Active	PLCC	52 (4 x 13)	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Phosphor Bronze	Surface Mount	Board Guide, Closed Frame	Solder	0.050" (1.27mm)	Tin	-	Phosphor Bronze	Thermoplastic, Glass Filled	-50°C ~ 105°C
146-43-308-41-013000 CONN IC DIP SOCKET 8POS GOLD Mill-Max Manufacturing Corp.	120	-	RFQ	데이터시트	146	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
115-83-320-41-001101 CONN IC DIP SOCKET 20POS GOLD Preci-Dip	237	-	RFQ	데이터시트	115	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
110-83-624-41-001101 CONN IC DIP SOCKET 24POS GOLD Preci-Dip	1,016	-	RFQ	데이터시트	110	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
940-44-032-17-400004 CONN SOCKET PLCC 32POS SMD Mill-Max Manufacturing Corp.	390	-	RFQ	데이터시트	940	Tape & Reel (TR)	Active	PLCC	32 (2 x 7, 2 x 9)	0.050" (1.27mm)	Tin	150.0µin (3.81µm)	-	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	200.0µin (5.08µm)	-	Polyphenylene Sulfide (PPS)	-
ICO-314-MTT .100" LOW PROFILE SCREW MACHINE Samtec Inc.	11	-	RFQ	데이터시트	ICO	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polyester, Glass Filled	-55°C ~ 105°C
8452-21B1-RK-TR CONN SOCKET PLCC 52POS TIN 3M	1,857	-	RFQ	데이터시트	8400	Tape & Reel (TR)	Active	PLCC	52 (4 x 13)	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
4602 CONN TRANSIST TO-3 3POS TIN Keystone Electronics	1,759	-	RFQ	데이터시트	-	Bulk	Active	Transistor, TO-3	3 (Oval)	-	Tin	-	Brass	Chassis Mount	Closed Frame	Solder	-	Tin	-	Brass	Polyester, Glass Filled	-
2485265-1 DIP IC SOCKET 40P,GOLD FLASH TE Connectivity AMP Connectors	1,950	-	RFQ	데이터시트	-	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	40	0.100" (2.54mm)	Gold	Flash	Copper Alloy	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	78.7µin (2.00µm)	Copper Alloy	Thermoplastic	-55°C ~ 125°C
540-44-032-17-400004 CONN SKT PLCC Mill-Max Manufacturing Corp.	800	-	RFQ	데이터시트	540	Tape & Reel (TR)	Active	PLCC	32 (2 x 7, 2 x 9)	0.050" (1.27mm)	Tin	100.0µin (2.54µm)	-	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	200.0µin (5.08µm)	-	Polyphenylene Sulfide (PPS)	-
123-83-316-41-001101 CONN IC DIP SOCKET 16POS GOLD Preci-Dip	1,058	-	RFQ	데이터시트	123	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
110-93-424-41-001000 CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp.	183	-	RFQ	데이터시트	110	Tube	Active	DIP, 0.4" (10.16mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C

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