Chipkind 전자 - IC 소켓 - Sockets for ICs, Transistors - 페이지 33 - 원본 상품 출처 - Chipkind 전자- IC 유통업체 및 전자 부품 공급업체

제조업체 부품 번호	재고 상태	가격	수량	데이터시트	시리즈	패키징	제품 상태	유형	위치 또는 핀 수(그리드)	피치 - Mating	접촉 마감 - 결합	접촉 마감 두께 - Mating	접촉 재료 - Mating	장착 유형	기능	종단	피치 - 포스트	접촉 마감 - 포스트	접촉 마감 두께 - 포스트	접촉 재료 - 포스트	하우징 소재	작동 온도
2444090-3 CONN SOCKET SIP 16POS GOLD TE Connectivity AMP Connectors	0	-	RFQ	데이터시트	-	Bulk	Active	SIP	16	0.100" (2.54mm)	Gold	Flash	Copper Alloy	Through Hole	-	Solder	0.100" (2.54mm)	Tin	78.7µin (2.00µm)	Copper Alloy	Thermoplastic	-
2444090-5 CONN SOCKET SIP 20POS GOLD TE Connectivity AMP Connectors	0	-	RFQ	데이터시트	-	Bulk	Active	SIP	20	0.100" (2.54mm)	Gold	Flash	Copper Alloy	Through Hole	-	Solder	0.100" (2.54mm)	Tin	78.7µin (2.00µm)	Copper Alloy	Thermoplastic	-
2485267-1 DIP IC SOCKET 6P,GOLD FLASH-SMD TE Connectivity AMP Connectors	5,400	-	RFQ	데이터시트	-	Tape & Reel (TR)	Active	DIP, 0.3" (7.62mm) Row Spacing	6	0.100" (2.54mm)	Gold	Flash	Copper Alloy	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	78.7µin (2.00µm)	Copper Alloy	Thermoplastic	-55°C ~ 125°C
2485267-2 DIP IC SOCKET 8P,GOLD FLASH-SMD TE Connectivity AMP Connectors	5,397	-	RFQ	데이터시트	-	Tape & Reel (TR)	Active	DIP, 0.3" (7.62mm) Row Spacing	8	0.100" (2.54mm)	Gold	Flash	Copper Alloy	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	78.7µin (2.00µm)	Copper Alloy	Thermoplastic	-55°C ~ 125°C
2485267-3 DIP IC SOCKET 10P,GOLD FLASH-SMD TE Connectivity AMP Connectors	5,400	-	RFQ	데이터시트	-	Tape & Reel (TR)	Active	DIP, 0.3" (7.62mm) Row Spacing	10	0.100" (2.54mm)	Gold	Flash	Copper Alloy	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	78.7µin (2.00µm)	Copper Alloy	Thermoplastic	-55°C ~ 125°C
2485267-4 DIP IC SOCKET 12P,GOLD FLASH-SMD TE Connectivity AMP Connectors	5,399	-	RFQ	데이터시트	-	Tape & Reel (TR)	Active	DIP, 0.3" (7.62mm) Row Spacing	12	0.100" (2.54mm)	Gold	Flash	Copper Alloy	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	78.7µin (2.00µm)	Copper Alloy	Thermoplastic	-55°C ~ 125°C
ICF-308-T-I-TR .100" SURFACE MOUNT SCREW MACHIN Samtec Inc.	950	-	RFQ	데이터시트	ICF	Tape & Reel (TR)	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Beryllium Copper	Liquid Crystal Polymer (LCP)	-55°C ~ 125°C
05-0518-00 CONN SOCKET SIP 5POS GOLD Aries Electronics	885	-	RFQ	데이터시트	518	Bulk	Active	SIP	5 (1 x 5)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
115-47-308-41-003000 CONN IC DIP SOCKET 8POS GOLD Mill-Max Manufacturing Corp.	1,067	-	RFQ	데이터시트	115	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
2445893-1 DIP IC SOCKET 8P SMT TE Connectivity AMP Connectors	4,500	-	RFQ	데이터시트	-	Tape & Reel (TR)	Active	DIP, 0.3" (7.62mm) Row Spacing	8	0.100" (2.54mm)	Gold	Flash	Copper Alloy	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	78.7µin (2.00µm)	Copper Alloy	Thermoplastic	-55°C ~ 125°C
SMPX-32LCC-N SMT PLCC SOCKET 32P NON POLARISE Kycon, Inc.	179	-	RFQ	데이터시트	SMPX	Tube	Active	PLCC	32 (2 x 7, 2 x 9)	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	-	Phosphor Bronze	Thermoplastic, Glass Filled	-50°C ~ 105°C
2444090-1 CONN SOCKET SIP 10POS GOLD TE Connectivity AMP Connectors	0	-	RFQ	데이터시트	-	Bulk	Active	SIP	10	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Copper Alloy	Through Hole	-	Solder	0.100" (2.54mm)	Tin	78.7µin (2.00µm)	Copper Alloy	Thermoplastic	-
2485264-5 DIP IC SOCKET 18P,SN TE Connectivity AMP Connectors	5,720	-	RFQ	데이터시트	-	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	18	0.100" (2.54mm)	Tin	196.9µin (5.00µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	78.7µin (2.00µm)	Copper Alloy	Thermoplastic	-55°C ~ 125°C
8420-21A1-RK-TP CONN SOCKET PLCC 20POS TIN 3M	2,808	-	RFQ	데이터시트	8400	Tube	Active	PLCC	20 (4 x 5)	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Surface Mount	Closed Frame	Solder	0.100" (2.54mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
2485264-2 DIP IC SOCKET 14P-SN TE Connectivity AMP Connectors	7,641	-	RFQ	데이터시트	-	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14	0.100" (2.54mm)	Tin	196.9µin (5.00µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	78.7µin (2.00µm)	Copper Alloy	Thermoplastic	-55°C ~ 125°C
2444090-4 SIP IC SKT 20 AU0.75 TE Connectivity AMP Connectors	0	-	RFQ	데이터시트	-	Tray	Active	SIP	20	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Copper Alloy	Through Hole	-	Solder	0.100" (2.54mm)	Tin	78.7µin (2.00µm)	Copper Alloy	Thermoplastic	-55°C ~ 125°C
2485264-6 DIP IC SOCKET 20P,SN TE Connectivity AMP Connectors	5,228	-	RFQ	데이터시트	-	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	20	0.100" (2.54mm)	Tin	196.9µin (5.00µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	78.7µin (2.00µm)	Copper Alloy	Thermoplastic	-55°C ~ 125°C
2485264-3 DIP IC SOCKET 16P,SN TE Connectivity AMP Connectors	6,519	-	RFQ	데이터시트	-	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	16	0.100" (2.54mm)	Tin	196.9µin (5.00µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	78.7µin (2.00µm)	Copper Alloy	Thermoplastic	-55°C ~ 125°C
8420-21B1-RK-TR CONN SOCKET PLCC 20POS TIN 3M	1,286	-	RFQ	데이터시트	8400	Tape & Reel (TR)	Active	PLCC	20 (4 x 5)	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
214-44-308-01-670799 STANDRD SOLDER TAIL DIP SOCKET Mill-Max Manufacturing Corp.	1,000	-	RFQ	데이터시트	214	Tape & Reel (TR)	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Tin	100.0µin (2.54µm)	Beryllium Copper	Surface Mount	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polyamide (PA46), Nylon 4/6	-55°C ~ 125°C

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