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IC 소켓
| 사진 | 제조업체 부품 번호 | 재고 상태 | 수량 | 데이터시트 | 시리즈 | 패키징 | 제품 상태 | 유형 | 위치 또는 핀 수(그리드) | 피치 - Mating | 접촉 마감 - 결합 | 접촉 마감 두께 - Mating | 접촉 재료 - Mating | 장착 유형 | 기능 | 종단 | 피치 - 포스트 | 접촉 마감 - 포스트 | 접촉 마감 두께 - 포스트 | 접촉 재료 - 포스트 | 하우징 소재 | 작동 온도 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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APH-1908-T-TAPH-1908-T-T |
0 |
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데이터시트 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-0208-T-TAPH-0208-T-T |
0 |
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데이터시트 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-0708-T-TAPH-0708-T-T |
0 |
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데이터시트 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
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APH-1808-T-TAPH-1808-T-T |
0 |
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데이터시트 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-1708-T-TAPH-1708-T-T |
0 |
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데이터시트 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
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APH-0408-T-TAPH-0408-T-T |
0 |
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데이터시트 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-0908-T-TAPH-0908-T-T |
0 |
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데이터시트 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
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APH-0808-T-TAPH-0808-T-T |
0 |
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데이터시트 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
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APH-1308-T-TAPH-1308-T-T |
0 |
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데이터시트 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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XR2A-2025CONN IC DIP SOCKET 20POS GOLD |
0 |
|
데이터시트 |
XR2 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
|
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18-6513-10HCONN IC DIP SOCKET 18POS GOLD |
0 |
|
데이터시트 |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
|
20-9513-11CONN IC DIP SOCKET 20POS GOLD |
0 |
|
데이터시트 |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.9" (22.86mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
|
08-2822-90CONN IC DIP SOCKET 8POS GOLD |
0 |
|
데이터시트 |
Vertisockets™ 800 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 | - |
|
|
08-2823-90CONN IC DIP SOCKET 8POS GOLD |
0 |
|
데이터시트 |
Vertisockets™ 800 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 | - |
|
|
08-820-90CONN IC DIP SOCKET 8POS GOLD |
0 |
|
데이터시트 |
Vertisockets™ 800 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 | - |
|
|
08-822-90CONN IC DIP SOCKET 8POS GOLD |
0 |
|
데이터시트 |
Vertisockets™ 800 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 | - |
|
|
17-0517-90CCONN SOCKET SIP 17POS GOLD |
0 |
|
데이터시트 |
0517 | Bulk | Active | SIP | 17 (1 x 17) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle | - | Solder | - | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
|
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ICO-314-NGT.100" LOW PROFILE SCREW MACHINE |
0 |
|
데이터시트 |
ICO | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 10.0µin (0.25µm) | Brass | Polyester, Glass Filled | -55°C ~ 125°C |
|
|
510-87-168-17-001101CONN SOCKET PGA 168POS GOLD |
0 |
|
데이터시트 |
510 | Bulk | Active | PGA | 168 (17 x 17) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
510-87-168-17-101101CONN SOCKET PGA 168POS GOLD |
0 |
|
데이터시트 |
510 | Bulk | Active | PGA | 168 (17 x 17) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
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