Chipkind 전자 - IC 소켓 - Sockets for ICs, Transistors - 페이지 310 - 원본 상품 출처 - Chipkind 전자- IC 유통업체 및 전자 부품 공급업체

제조업체 부품 번호	가격	수량	데이터시트	시리즈	패키징	제품 상태	유형	위치 또는 핀 수(그리드)	피치 - Mating	접촉 마감 - 결합	접촉 마감 두께 - Mating	접촉 재료 - Mating	장착 유형	기능	종단	피치 - 포스트	접촉 마감 - 포스트	접촉 마감 두께 - 포스트	접촉 재료 - 포스트	하우징 소재	작동 온도
08-8900-310C CONN IC DIP SOCKET 8POS GOLD Aries Electronics	-	RFQ	데이터시트	8	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
08-8937-610C CONN IC DIP SOCKET 8POS GOLD Aries Electronics	-	RFQ	데이터시트	8	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
28-6513-11 CONN IC DIP SOCKET 28POS GOLD Aries Electronics	-	RFQ	데이터시트	Lo-PRO®file, 513	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
14-3518-10E CONN IC DIP SOCKET 14POS GOLD Aries Electronics	-	RFQ	데이터시트	518	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
116-83-650-41-006101 CONN IC DIP SOCKET 50POS GOLD Preci-Dip	-	RFQ	데이터시트	116	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	50 (2 x 25)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
8114LB603 THM,11692 REV J Boyd Laconia, LLC	-	RFQ	데이터시트	-	Bulk	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
117-87-668-41-105101 CONN IC DIP SOCKET 68POS GOLD Preci-Dip	-	RFQ	데이터시트	117	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	68 (2 x 34)	0.070" (1.78mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.070" (1.78mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
ICA-308-WGG-3 .100" SCREW MACHINE DIP SOCKET Samtec Inc.	-	RFQ	데이터시트	ICA	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Brass	Polyester, Glass Filled	-55°C ~ 125°C
ICA-624-ZSST .100" SCREW MACHINE DIP SOCKET Samtec Inc.	-	RFQ	데이터시트	ICA	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polyester, Glass Filled	-55°C ~ 125°C
HLS-0314-TT-2 .100" SCREW MACHINE SOCKET ARRAY Samtec Inc.	-	RFQ	데이터시트	HLS	Tube	Active	SIP	42 (3 x 14)	0.100" (2.54mm)	Tin	-	-	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	-	-	Thermoplastic	-55°C ~ 140°C
08-6501-21 CONN IC DIP SOCKET 8POS GOLD Aries Electronics	-	RFQ	데이터시트	501	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
116-87-650-41-007101 CONN IC DIP SOCKET 50POS GOLD Preci-Dip	-	RFQ	데이터시트	116	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	50 (2 x 25)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
346-93-119-41-013000 CONN SOCKET SIP 19POS GOLD Mill-Max Manufacturing Corp.	-	RFQ	데이터시트	346	Bulk	Active	SIP	19 (1 x 19)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Press-Fit	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
346-43-119-41-013000 CONN SOCKET SIP 19POS GOLD Mill-Max Manufacturing Corp.	-	RFQ	데이터시트	346	Bulk	Active	SIP	19 (1 x 19)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Press-Fit	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
ICF-328-S-O-TR .100" SURFACE MOUNT SCREW MACHIN Samtec Inc.	-	RFQ	데이터시트	ICF	Tape & Reel (TR)	Active	DIP, 0.3" (7.62mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Beryllium Copper	Liquid Crystal Polymer (LCP)	-55°C ~ 125°C
08-6501-31 CONN IC DIP SOCKET 8POS GOLD Aries Electronics	-	RFQ	데이터시트	501	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
08-0508-21 CONN SOCKET SIP 8POS GOLD Aries Electronics	-	RFQ	데이터시트	508	Bulk	Active	SIP	8 (1 x 8)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Wire Wrap	-	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6	-55°C ~ 125°C
08-0508-31 CONN SOCKET SIP 8POS GOLD Aries Electronics	-	RFQ	데이터시트	508	Bulk	Active	SIP	8 (1 x 8)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Wire Wrap	-	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6	-55°C ~ 125°C
08-1508-21 CONN IC DIP SOCKET 8POS GOLD Aries Electronics	-	RFQ	데이터시트	508	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6	-55°C ~ 125°C
08-1508-31 CONN IC DIP SOCKET 8POS GOLD Aries Electronics	-	RFQ	데이터시트	508	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6	-55°C ~ 125°C

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