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    제조업체 시리즈 패키징 제품 상태 유형 패키지 냉각 부착 방법 모양 길이 너비 직경 핀 높이 온도 상승 시 전력 소모 강제 공기 흐름 시 열 저항 자연 시 열 저항 소재 재료 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    모두 초기화
    모두 적용
    결과
    사진 제조업체 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 패키지 냉각 부착 방법 모양 길이 너비 직경 핀 높이 온도 상승 시 전력 소모 강제 공기 흐름 시 열 저항 자연 시 열 저항 소재 재료 마감
    274-2AB

    274-2AB

    HEATSINK LOW HEIGHT BLK TO-220

    Wakefield-Vette

    728
    RFQ
    274-2AB

    데이터시트

    274 Bulk Active Board Level TO-220 Bolt On Rectangular, Fins 0.750" (19.05mm) 0.520" (13.21mm) - 0.500" (12.70mm) 2.0W @ 50°C 7.00°C/W @ 400 LFM 25.00°C/W Aluminum Black Anodized
    XL25W-TO220-18.5-12-1

    XL25W-TO220-18.5-12-1

    CERAMIC HEAT SPREADER 18.5X12MM

    t-Global Technology

    466
    RFQ
    XL25W-TO220-18.5-12-1

    데이터시트

    XL-25 Bulk Active Heat Spreader TO-220 Thermal Tape Rectangular 0.728" (18.50mm) 0.472" (12.00mm) - 0.476" (12.10mm) - - - Ceramic -
    XL25W-TO220-20-14-0.64

    XL25W-TO220-20-14-0.64

    CERAMIC HEAT SPREADER 20X14MM WH

    t-Global Technology

    853
    RFQ
    XL25W-TO220-20-14-0.64

    데이터시트

    XL-25 Bulk Active Heat Spreader TO-220 Thermal Tape Rectangular 0.787" (20.00mm) 0.551" (14.00mm) - 0.025" (0.64mm) - - - Ceramic -
    ATS-PCB1004

    ATS-PCB1004

    HEATSINK TO-220 CLIP-ON BLK

    Advanced Thermal Solutions Inc.

    244
    RFQ
    ATS-PCB1004

    데이터시트

    - Bulk Active Board Level TO-220 Bolt On Rectangular, Fins 0.752" (19.10mm) 0.860" (21.84mm) - 0.394" (10.00mm) - 12.70°C/W @ 200 LFM 23.20°C/W Aluminum Black Anodized
    XL25W-TO220-20-14-1

    XL25W-TO220-20-14-1

    CERAMIC HEAT SPREADER 20X14MM WH

    t-Global Technology

    199
    RFQ
    XL25W-TO220-20-14-1

    데이터시트

    XL-25 Bulk Active Heat Spreader TO-220 Thermal Tape Rectangular 0.787" (20.00mm) 0.551" (14.00mm) - 0.039" (1.00mm) - - - Ceramic -
    HSS-B20-0635H

    HSS-B20-0635H

    HEATSINK TO-220 2.6W ALUMINUM

    Same Sky (Formerly CUI Devices)

    701
    RFQ
    HSS-B20-0635H

    데이터시트

    HSS Bag Active Board Level, Vertical TO-220 PC Pin Rectangular, Fins 0.520" (13.20mm) 0.250" (6.35mm) - 0.748" (19.00mm) 2.6W @ 75°C 10.68°C/W @ 200 LFM 28.85°C/W Aluminum Black Anodized
    V2110B

    V2110B

    HEATSINK TO-126 13.20X19.68MM

    Assmann WSW Components

    407
    RFQ
    V2110B

    데이터시트

    - Bulk Active Board Level, Vertical TO-126 Press Fit, Slide On Rectangular, Fins 0.520" (13.20mm) 0.775" (19.68mm) - 0.320" (8.13mm) - - 26.00°C/W Aluminum Black Anodized
    HSS-B20-NPR-01

    HSS-B20-NPR-01

    HEATSINK TO-220 4.2W ALUMINUM

    Same Sky (Formerly CUI Devices)

    170
    RFQ
    HSS-B20-NPR-01

    데이터시트

    HSS Bag Active Board Level TO-220 Bolt On Rectangular, Fins 1.180" (29.97mm) 1.000" (25.40mm) - 0.500" (12.70mm) 4.2W @ 75°C 5.88°C/W @ 200 LFM 17.74°C/W Aluminum Black Anodized
    XL25W-TO3P-25-20-1

    XL25W-TO3P-25-20-1

    CERAMIC HEAT SPREADER 25X20MM WH

    t-Global Technology

    806
    RFQ
    XL25W-TO3P-25-20-1

    데이터시트

    XL-25 Bulk Active Heat Spreader TO-3P Thermal Tape Rectangular 0.984" (25.00mm) 0.787" (20.00mm) - 0.039" (1.00mm) - - - Ceramic -
    V2008B

    V2008B

    HEATSINK BLK ALUM TO-220 DUAL

    Assmann WSW Components

    373
    RFQ
    V2008B

    데이터시트

    - Bulk Active Board Level TO-220 (Dual) Bolt On Rectangular, Fins 1.450" (36.83mm) 1.750" (44.45mm) - 0.370" (9.40mm) - - 7.00°C/W Aluminum Black Anodized
    V2109B

    V2109B

    HEATSINK TO-220 29.97X25.40MM

    Assmann WSW Components

    805
    RFQ
    V2109B

    데이터시트

    - Bulk Active Board Level TO-220 Bolt On Rectangular, Fins 1.180" (29.97mm) 1.000" (25.40mm) - 0.500" (12.70mm) - - 20.00°C/W Aluminum Black Anodized
    V2023B

    V2023B

    HEATSINK CPU XCUT

    Assmann WSW Components

    259
    RFQ
    V2023B

    데이터시트

    - Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Not Included) Square, Pin Fins 0.906" (23.00mm) 0.906" (23.00mm) - 0.236" (6.00mm) - - 22.00°C/W Aluminum Alloy Black Anodized
    HSS-B20-CP-01

    HSS-B20-CP-01

    HEATSINK TO-220 2.6W ALUMINUM

    Same Sky (Formerly CUI Devices)

    41
    RFQ
    HSS-B20-CP-01

    데이터시트

    HSS Box Active Board Level TO-220 Clip Rectangular, Fins 0.375" (9.53mm) 0.900" (22.86mm) - 0.740" (18.79mm) 2.6W @ 75°C 6.32°C/W @ 200 LFM 28.85°C/W Aluminum Black Anodized
    V7477X

    V7477X

    HEATSINK ALUM ANOD

    Assmann WSW Components

    255
    RFQ
    V7477X

    데이터시트

    - Tray Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Bolt On and PC Pin Square, Fins 1.457" (37.00mm) 1.457" (37.00mm) - 0.500" (12.70mm) - - 11.00°C/W Aluminum Black Anodized
    V5629G

    V5629G

    HEATSINK ALUM ANOD

    Assmann WSW Components

    953
    RFQ
    V5629G

    데이터시트

    - Bulk Active Board Level TO-220 Bolt On Rectangular, Fins 0.984" (25.00mm) 0.472" (12.00mm) - 0.256" (6.50mm) - - 40.00°C/W Aluminum Black Anodized
    V2026B

    V2026B

    HEATSINK CPU XCUT

    Assmann WSW Components

    986
    RFQ
    V2026B

    데이터시트

    - Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.063" (27.00mm) 1.063" (27.00mm) - 0.236" (6.00mm) - - 20.00°C/W Aluminum Alloy Black Anodized
    HSB04-171706

    HSB04-171706

    HEAT SINK, BGA, 17 X 17 X 6 MM

    Same Sky (Formerly CUI Devices)

    759
    RFQ
    HSB04-171706

    데이터시트

    HSB Box Active Top Mount BGA Adhesive (Not Included) Square, Pin Fins 0.669" (17.00mm) 0.669" (17.00mm) - 0.236" (6.00mm) 2.5W @ 75°C 13.10°C/W @ 200 LFM 29.73°C/W Aluminum Alloy Black Anodized
    V4330N

    V4330N

    HEATSINK ANOD ALUM TO-220

    Assmann WSW Components

    549
    RFQ
    V4330N

    데이터시트

    - Tray Active Top Mount TO-220 Bolt On Rectangular, Fins 0.787" (20.00mm) 1.142" (29.00mm) - 0.472" (12.00mm) - - 12.00°C/W Aluminum Black Anodized
    HSS-B20-061H

    HSS-B20-061H

    HEATSINK TO-220 4W ALUMINUM

    Same Sky (Formerly CUI Devices)

    954
    RFQ
    HSS-B20-061H

    데이터시트

    HSS Box Active Board Level TO-220 PC Pin Rectangular, Fins 1.500" (38.10mm) 0.504" (12.80mm) - 0.500" (12.70mm) 4.0W @ 75°C 5.01°C/W @ 200 LFM 18.63°C/W Aluminum Black Anodized
    HSB07-202009

    HSB07-202009

    HEAT SINK, BGA, 20 X 20 X 9 MM

    Same Sky (Formerly CUI Devices)

    38
    RFQ
    HSB07-202009

    데이터시트

    HSB Box Active Top Mount BGA Adhesive (Not Included) Square, Pin Fins 0.787" (20.00mm) 0.787" (20.00mm) - 0.354" (9.00mm) 3.1W @ 75°C 8.60°C/W @ 200 LFM 24.08°C/W Aluminum Alloy Black Anodized
    Total 122183 Record«Prev1... 477478479480481482483484...6110Next»
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