Chipkind 전자 - IC 소켓 - Sockets for ICs, Transistors - 페이지 8 - 원본 상품 출처 - Chipkind 전자- IC 유통업체 및 전자 부품 공급업체

제조업체 부품 번호	재고 상태	가격	수량	데이터시트	시리즈	패키징	제품 상태	유형	위치 또는 핀 수(그리드)	피치 - Mating	접촉 마감 - 결합	접촉 마감 두께 - Mating	접촉 재료 - Mating	장착 유형	기능	종단	피치 - 포스트	접촉 마감 - 포스트	접촉 마감 두께 - 포스트	접촉 재료 - 포스트	하우징 소재	작동 온도
243-28-1-06 CONN IC DIP SOCKET 28POS TIN CNC Tech	1,524	-	RFQ	데이터시트	-	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Tin	100.0µin (2.54µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	100.0µin (2.54µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
1-2199298-6 CONN IC DIP SOCKET 20POS TIN TE Connectivity AMP Connectors	2,473	-	RFQ	데이터시트	Diplomate DL	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass, Copper	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
D01-9970242 CONN SOCKET SIP 2POS GOLD Harwin Inc.	16,032	-	RFQ	데이터시트	D01-997	Bag	Active	SIP	2 (1 x 2)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Threaded	-	Solder	0.100" (2.54mm)	Tin	196.9µin (5.00µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
XR2C-0311-N CONN SOCKET SIP 3POS GOLD Omron Electronics Inc-EMC Div	3,654	-	RFQ	데이터시트	XR2	Bulk	Active	SIP	3 (1 x 3)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 125°C
245-24-1-06 CONN IC DIP SOCKET 24POS TIN CNC Tech	2,060	-	RFQ	데이터시트	-	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Through Hole, Kinked Pin	Open Frame	Solder	0.100" (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
110-44-306-41-001000 CONN IC DIP SOCKET 6POS TIN Mill-Max Manufacturing Corp.	1,701	-	RFQ	데이터시트	110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Tin	100.0µin (2.54µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
AR 08-HZL/01-TT CONN IC DIP SOCKET 8POS GOLD Assmann WSW Components	6,895	-	RFQ	데이터시트	-	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester	-40°C ~ 105°C
D01-9970642 CONN SOCKET SIP 6POS GOLD Harwin Inc.	28,251	-	RFQ	데이터시트	D01-997	Tube	Active	SIP	6 (1 x 6)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin	196.9µin (5.00µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
AR 20-HZL-TT CONN IC DIP SOCKET 20POS TIN Assmann WSW Components	1,980	-	RFQ	데이터시트	-	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester	-40°C ~ 105°C
245-28-1-06 CONN IC DIP SOCKET 28POS TIN CNC Tech	1,068	-	RFQ	데이터시트	-	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Through Hole, Kinked Pin	Open Frame	Solder	0.100" (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
D01-9970542 CONN SOCKET SIP 5POS GOLD Harwin Inc.	2,593	-	RFQ	데이터시트	D01-997	Tube	Active	SIP	5 (1 x 5)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin	196.9µin (5.00µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
210-1-08-003 CONN IC DIP SOCKET 8POS GOLD CNC Tech	2,927	-	RFQ	데이터시트	-	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polybutylene Terephthalate (PBT)	-40°C ~ 105°C
4808-3000-CP CONN IC DIP SOCKET 8POS TIN 3M	24,688	-	RFQ	데이터시트	4800	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Tin	35.4µin (0.90µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	35.0µin (0.90µm)	Phosphor Bronze	Polyester, Glass Filled	-25°C ~ 85°C
243-40-1-06 CONN IC DIP SOCKET 40POS TIN CNC Tech	1,711	-	RFQ	데이터시트	-	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Tin	100.0µin (2.54µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	100.0µin (2.54µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
4816-3000-CP CONN IC DIP SOCKET 16POS TIN 3M	11,180	-	RFQ	데이터시트	4800	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Tin	35.4µin (0.90µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	35.0µin (0.90µm)	Phosphor Bronze	Polyester, Glass Filled	-25°C ~ 85°C
4814-3004-CP CONN IC DIP SOCKET 14POS TIN 3M	9,841	-	RFQ	데이터시트	4800	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Tin	35.4µin (0.90µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	35.0µin (0.90µm)	Phosphor Bronze	Polyester, Glass Filled	-25°C ~ 85°C
4814-3000-CP CONN IC DIP SOCKET 14POS TIN 3M	8,797	-	RFQ	데이터시트	4800	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Tin	35.4µin (0.90µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	35.0µin (0.90µm)	Phosphor Bronze	Polyester, Glass Filled	-25°C ~ 85°C
SA103000 CONN IC DIP SOCKET 10POS GOLD On Shore Technology Inc.	3,976	-	RFQ	데이터시트	SA	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Thermoplastic, Polyester, Glass Filled	-40°C ~ 105°C
110-99-308-41-001000 CONN IC DIP SOCKET 8POS TIN-LEAD Mill-Max Manufacturing Corp.	2,011	-	RFQ	데이터시트	110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
1-2199298-8 CONN IC DIP SOCKET 24POS TIN TE Connectivity AMP Connectors	1,238	-	RFQ	데이터시트	Diplomate DL	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass, Copper	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C

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