- 큰 재고
- 클라우드 가격
IC 소켓
| 사진 | 제조업체 부품 번호 | 재고 상태 | 수량 | 데이터시트 | 시리즈 | 패키징 | 제품 상태 | 유형 | 위치 또는 핀 수(그리드) | 피치 - Mating | 접촉 마감 - 결합 | 접촉 마감 두께 - Mating | 접촉 재료 - Mating | 장착 유형 | 기능 | 종단 | 피치 - 포스트 | 접촉 마감 - 포스트 | 접촉 마감 두께 - 포스트 | 접촉 재료 - 포스트 | 하우징 소재 | 작동 온도 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
APO-324-G-A.100" LOW PROFILE SCREW MACHINE |
0 |
|
데이터시트 |
APO | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | - |
|
|
APH-0508-G-RAPH-0508-G-R |
0 |
|
데이터시트 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-1308-G-RAPH-1308-G-R |
0 |
|
데이터시트 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-1208-G-RAPH-1208-G-R |
0 |
|
데이터시트 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-0908-G-RAPH-0908-G-R |
0 |
|
데이터시트 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-1408-G-RAPH-1408-G-R |
0 |
|
데이터시트 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-1708-G-RAPH-1708-G-R |
0 |
|
데이터시트 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-0708-G-RAPH-0708-G-R |
0 |
|
데이터시트 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
510-83-241-19-101101CONN SOCKET PGA 241POS GOLD |
0 |
|
데이터시트 |
510 | Bulk | Active | PGA | 241 (19 x 19) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
20-1508-21CONN IC DIP SOCKET 20POS GOLD |
0 |
|
데이터시트 |
508 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6 | -55°C ~ 125°C |
|
|
20-1508-31CONN IC DIP SOCKET 20POS GOLD |
0 |
|
데이터시트 |
508 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6 | -55°C ~ 125°C |
|
|
116-47-316-41-007000STANDRD SOLDRTL DBL SKT |
0 |
|
데이터시트 |
116 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
317-93-114-41-005000CONN SKT SNG |
0 |
|
데이터시트 |
317 | Bulk | Active | SIP | 14 (1 x 14) | 0.070" (1.78mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Solder | 0.070" (1.78mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
116-41-318-41-003000CONN IC SKT DBL |
0 |
|
데이터시트 |
116 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
116-91-318-41-003000CONN IC SKT DBL |
0 |
|
데이터시트 |
116 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
APA-320-G-MADAPTER PLUG |
0 |
|
데이터시트 |
APA | Tube | Active | - | 20 (2 x 10) | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | - |
|
|
410-91-224-10-001000STANDRD SOLDRTL DBL SKT |
0 |
|
데이터시트 |
410 | Tube | Active | Zig-Zag, Left Stackable | 24 (2 x 12) | 0.100" (2.54mm) | - | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
410-91-224-10-002000STANDRD SOLDRTL DBL SKT |
0 |
|
데이터시트 |
410 | Tube | Active | Zig-Zag, Right Stackable | 24 (2 x 12) | 0.100" (2.54mm) | - | - | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
116-41-320-41-003000CONN IC SKT DBL |
0 |
|
데이터시트 |
116 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
116-41-420-41-003000CONN IC SKT DBL |
0 |
|
데이터시트 |
116 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
- 1500+ 일일 평균 RFQ 볼륨
- 20,000.000 표준 제품 단위
- 1800+ 전 세계 제조업체
- 15,000+ 재고 창고
