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    홈 > 제품  > 커넥터, 상호 연결 > IC, 트랜지스터용 소켓 > IC 소켓

    IC 소켓

    제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    모두 초기화
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    결과
    사진 제조업체 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
    614-93-310-31-007000

    614-93-310-31-007000

    SOCKET CARRIER LOWPRO .300 10POS

    Mill-Max Manufacturing Corp.

    		 0
    RFQ
    		614-93-310-31-007000

    데이터시트

         		614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-41-210-41-001000

    123-41-210-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 0
    RFQ
    		123-41-210-41-001000

    데이터시트

         		123 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-43-310-31-007000

    614-43-310-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 0
    RFQ
    		614-43-310-31-007000

    데이터시트

         		614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    32-3551-10

    32-3551-10

    CONN IC DIP SOCKET ZIF 32POS TIN

    Aries Electronics

    		 0
    RFQ
    		32-3551-10

    데이터시트

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    32-3552-10

    32-3552-10

    CONN IC DIP SOCKET ZIF 32POS TIN

    Aries Electronics

    		 0
    RFQ
    		32-3552-10

    데이터시트

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    32-3553-10

    32-3553-10

    CONN IC DIP SOCKET ZIF 32POS TIN

    Aries Electronics

    		 0
    RFQ
    		32-3553-10

    데이터시트

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    32-6552-10

    32-6552-10

    CONN IC DIP SOCKET ZIF 32POS TIN

    Aries Electronics

    		 0
    RFQ
    		32-6552-10

    데이터시트

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    32-6553-10

    32-6553-10

    CONN IC DIP SOCKET ZIF 32POS GLD

    Aries Electronics

    		 0
    RFQ
    		32-6553-10

    데이터시트

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    317-91-114-41-005000

    317-91-114-41-005000

    CONN SKT SNG

    Mill-Max Manufacturing Corp.

    		 0
    RFQ
    		317-91-114-41-005000

    데이터시트

         		317 Bulk Active SIP 14 (1 x 14) 0.070" (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-41-310-41-002000

    126-41-310-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 0
    RFQ
    		126-41-310-41-002000

    데이터시트

         		126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-91-310-41-002000

    126-91-310-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 0
    RFQ
    		126-91-310-41-002000

    데이터시트

         		126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0607-T-2-L

    HLS-0607-T-2-L

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    		 0
    RFQ
    		HLS-0607-T-2-L

    데이터시트

         		HLS Bulk Active SIP 42 (6 x 7) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    APH-0524-T-R

    APH-0524-T-R

    APH-0524-T-R

    Samtec Inc.

    		 0
    RFQ
    		APH-0524-T-R

    데이터시트

         		* - Active - - - - - - - - - - - - - - -
    APH-0920-T-T

    APH-0920-T-T

    APH-0920-T-T

    Samtec Inc.

    		 0
    RFQ
    		APH-0920-T-T

    데이터시트

         		* - Active - - - - - - - - - - - - - - -
    APH-0924-T-R

    APH-0924-T-R

    APH-0924-T-R

    Samtec Inc.

    		 0
    RFQ
    		APH-0924-T-R

    데이터시트

         		* - Active - - - - - - - - - - - - - - -
    APH-1424-T-R

    APH-1424-T-R

    APH-1424-T-R

    Samtec Inc.

    		 0
    RFQ
    		APH-1424-T-R

    데이터시트

         		* - Active - - - - - - - - - - - - - - -
    APH-1520-T-T

    APH-1520-T-T

    APH-1520-T-T

    Samtec Inc.

    		 0
    RFQ
    		APH-1520-T-T

    데이터시트

         		* - Active - - - - - - - - - - - - - - -
    APH-0624-T-R

    APH-0624-T-R

    APH-0624-T-R

    Samtec Inc.

    		 0
    RFQ
    		APH-0624-T-R

    데이터시트

         		* - Active - - - - - - - - - - - - - - -
    APH-0220-T-T

    APH-0220-T-T

    APH-0220-T-T

    Samtec Inc.

    		 0
    RFQ
    		APH-0220-T-T

    데이터시트

         		* - Active - - - - - - - - - - - - - - -
    APH-0324-T-R

    APH-0324-T-R

    APH-0324-T-R

    Samtec Inc.

    		 0
    RFQ
    		APH-0324-T-R

    데이터시트

         		* - Active - - - - - - - - - - - - - - -
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