Chipkind 전자 - IC 소켓 - Sockets for ICs, Transistors - 페이지 440 - 원본 상품 출처 - Chipkind 전자- IC 유통업체 및 전자 부품 공급업체

제조업체 부품 번호	가격	수량	데이터시트	시리즈	패키징	제품 상태	유형	위치 또는 핀 수(그리드)	피치 - Mating	접촉 마감 - 결합	접촉 마감 두께 - Mating	접촉 재료 - Mating	장착 유형	기능	종단	피치 - 포스트	접촉 마감 - 포스트	접촉 마감 두께 - 포스트	접촉 재료 - 포스트	하우징 소재	작동 온도
HLS-0216-T-30 .100" SCREW MACHINE SOCKET ARRAY Samtec Inc.	-	RFQ	데이터시트	HLS	Tube	Active	SIP	32 (2 x 16)	0.100" (2.54mm)	Tin	-	-	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	-	-	-	Thermoplastic	-55°C ~ 140°C
346-93-140-41-013000 CONN SOCKET SIP 40POS GOLD Mill-Max Manufacturing Corp.	-	RFQ	데이터시트	346	Bulk	Active	SIP	40 (1 x 40)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Press-Fit	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
346-43-140-41-013000 CONN SOCKET SIP 40POS GOLD Mill-Max Manufacturing Corp.	-	RFQ	데이터시트	346	Bulk	Active	SIP	40 (1 x 40)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Press-Fit	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
110-47-310-41-001000 STANDRD SOLDRTL Mill-Max Manufacturing Corp.	-	RFQ	데이터시트	110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
ICA-322-WGG .100" SCREW MACHINE DIP SOCKET Samtec Inc.	-	RFQ	데이터시트	ICA	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	22 (2 x 11)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Brass	Polyester, Glass Filled	-55°C ~ 125°C
ICA-422-WGG .100" SCREW MACHINE DIP SOCKET Samtec Inc.	-	RFQ	데이터시트	ICA	Tube	Active	DIP, 0.4" (10.16mm) Row Spacing	22 (2 x 11)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Brass	Polyester, Glass Filled	-55°C ~ 125°C
115-47-306-41-001000 STANDRD SOLDRTL DBL SKT Mill-Max Manufacturing Corp.	-	RFQ	데이터시트	115	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
HLS-0309-G-2 .100" SCREW MACHINE SOCKET ARRAY Samtec Inc.	-	RFQ	데이터시트	HLS	Tube	Active	SIP	27 (3 x 9)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	-	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	-	Thermoplastic	-55°C ~ 140°C
317-91-103-41-005000 CONN SKT SNG Mill-Max Manufacturing Corp.	-	RFQ	데이터시트	317	Bulk	Active	SIP	3 (1 x 3)	0.070" (1.78mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.070" (1.78mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
210-47-310-41-001000 STANDRD SOLDRTL DBL SKT Mill-Max Manufacturing Corp.	-	RFQ	데이터시트	210	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
20-9503-20 CONN IC DIP SOCKET 20POS GOLD Aries Electronics	-	RFQ	데이터시트	503	Bulk	Active	DIP, 0.9" (22.86mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
20-9503-30 CONN IC DIP SOCKET 20POS GOLD Aries Electronics	-	RFQ	데이터시트	503	Bulk	Active	DIP, 0.9" (22.86mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
64-9513-10 CONN IC DIP SOCKET 64POS GOLD Aries Electronics	-	RFQ	데이터시트	Lo-PRO®file, 513	Bulk	Active	DIP, 0.9" (22.86mm) Row Spacing	64 (2 x 32)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
HLS-0409-T-2 .100" SCREW MACHINE SOCKET ARRAY Samtec Inc.	-	RFQ	데이터시트	HLS	Bulk	Active	SIP	36 (4 x 9)	0.100" (2.54mm)	Tin	-	-	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	-	-	-	Thermoplastic	-55°C ~ 140°C
HLS-0410-S-2 .100" SCREW MACHINE SOCKET ARRAY Samtec Inc.	-	RFQ	데이터시트	HLS	Bulk	Active	SIP	40 (4 x 10)	0.100" (2.54mm)	Gold	-	-	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	-	-	-	Thermoplastic	-55°C ~ 140°C
APO-322-T-A .100" LOW PROFILE SCREW MACHINE Samtec Inc.	-	RFQ	데이터시트	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
16-71000-10 CONN SOCKET SIP 16POS TIN Aries Electronics	-	RFQ	데이터시트	700 Elevator Strip-Line™	Bulk	Active	SIP	16 (1 x 16)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
16-7415-10 CONN SOCKET SIP 16POS TIN Aries Electronics	-	RFQ	데이터시트	700 Elevator Strip-Line™	Bulk	Active	SIP	16 (1 x 16)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
16-7440-10 CONN SOCKET SIP 16POS TIN Aries Electronics	-	RFQ	데이터시트	700 Elevator Strip-Line™	Bulk	Active	SIP	16 (1 x 16)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
16-7500-10 CONN SOCKET SIP 16POS TIN Aries Electronics	-	RFQ	데이터시트	700 Elevator Strip-Line™	Bulk	Active	SIP	16 (1 x 16)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C

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