Chipkind 전자 - IC 소켓 - Sockets for ICs, Transistors - 페이지 435 - 원본 상품 출처 - Chipkind 전자- IC 유통업체 및 전자 부품 공급업체

제조업체 부품 번호	가격	수량	데이터시트	시리즈	패키징	제품 상태	유형	위치 또는 핀 수(그리드)	피치 - Mating	접촉 마감 - 결합	접촉 마감 두께 - Mating	접촉 재료 - Mating	장착 유형	기능	종단	피치 - 포스트	접촉 마감 - 포스트	접촉 마감 두께 - 포스트	접촉 재료 - 포스트	하우징 소재	작동 온도
18-3501-21 CONN IC DIP SOCKET 18POS GOLD Aries Electronics	-	RFQ	데이터시트	501	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
110-93-304-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	-	RFQ	데이터시트	110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	4 (2 x 2)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
23-0508-30 CONN SOCKET SIP 23POS GOLD Aries Electronics	-	RFQ	데이터시트	508	Bulk	Active	SIP	23 (1 x 23)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Wire Wrap	-	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6	-55°C ~ 105°C
210-44-306-41-001000 STANDRD SOLDRTL DBL SKT Mill-Max Manufacturing Corp.	-	RFQ	데이터시트	210	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Tin	100.0µin (2.54µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
210-99-306-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	-	RFQ	데이터시트	210	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Tin-Lead	100.0µin (2.54µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
510-83-168-17-001101 CONN SOCKET PGA 168POS GOLD Preci-Dip	-	RFQ	데이터시트	510	Bulk	Active	PGA	168 (17 x 17)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
15-7350-10 CONN SOCKET SIP 15POS TIN Aries Electronics	-	RFQ	데이터시트	700 Elevator Strip-Line™	Bulk	Active	SIP	15 (1 x 15)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
15-7450-10 CONN SOCKET SIP 15POS TIN Aries Electronics	-	RFQ	데이터시트	700 Elevator Strip-Line™	Bulk	Active	SIP	15 (1 x 15)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
15-7500-10 CONN SOCKET SIP 15POS TIN Aries Electronics	-	RFQ	데이터시트	700 Elevator Strip-Line™	Bulk	Active	SIP	15 (1 x 15)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
15-7540-10 CONN SOCKET SIP 15POS TIN Aries Electronics	-	RFQ	데이터시트	700 Elevator Strip-Line™	Bulk	Active	SIP	15 (1 x 15)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
15-7635-10 CONN SOCKET SIP 15POS TIN Aries Electronics	-	RFQ	데이터시트	700 Elevator Strip-Line™	Bulk	Active	SIP	15 (1 x 15)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
15-7695-10 CONN SOCKET SIP 15POS TIN Aries Electronics	-	RFQ	데이터시트	700 Elevator Strip-Line™	Bulk	Active	SIP	15 (1 x 15)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
15-7850-10 CONN SOCKET SIP 15POS TIN Aries Electronics	-	RFQ	데이터시트	700 Elevator Strip-Line™	Bulk	Active	SIP	15 (1 x 15)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
10-6810-90TWR CONN IC DIP SOCKET 10POS TIN Aries Electronics	-	RFQ	데이터시트	Vertisockets™ 800	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole, Right Angle, Vertical	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6	-
ICA-628-WGT-2 .100" SCREW MACHINE DIP SOCKET Samtec Inc.	-	RFQ	데이터시트	ICA	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	10.0µin (0.25µm)	Brass	Polyester, Glass Filled	-55°C ~ 125°C
24-6820-90C CONN IC DIP SOCKET 24POS GOLD Aries Electronics	-	RFQ	데이터시트	Vertisockets™ 800	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
24-6823-90C CONN IC DIP SOCKET 24POS GOLD Aries Electronics	-	RFQ	데이터시트	Vertisockets™ 800	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
APH-0906-G-R APH-0906-G-R Samtec Inc.	-	RFQ	데이터시트	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-1906-G-R APH-1906-G-R Samtec Inc.	-	RFQ	데이터시트	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-1006-G-R APH-1006-G-R Samtec Inc.	-	RFQ	데이터시트	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-

Total 19086 Record«Prev 1... 431 432 433 434435436 437 438...955 Next»