Chipkind 전자 - IC 소켓 - Sockets for ICs, Transistors - 페이지 381 - 원본 상품 출처 - Chipkind 전자- IC 유통업체 및 전자 부품 공급업체

제조업체 부품 번호	가격	수량	데이터시트	시리즈	패키징	제품 상태	유형	위치 또는 핀 수(그리드)	피치 - Mating	접촉 마감 - 결합	접촉 마감 두께 - Mating	접촉 재료 - Mating	장착 유형	기능	종단	피치 - 포스트	접촉 마감 - 포스트	접촉 마감 두께 - 포스트	접촉 재료 - 포스트	하우징 소재	작동 온도
10-0501-21 CONN SOCKET SIP 10POS GOLD Aries Electronics	-	RFQ	데이터시트	501	Bulk	Active	SIP	10 (1 x 10)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole	-	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
10-0501-31 CONN SOCKET SIP 10POS GOLD Aries Electronics	-	RFQ	데이터시트	501	Bulk	Active	SIP	10 (1 x 10)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole	-	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
510-87-238-19-101101 CONN SOCKET PGA 238POS GOLD Preci-Dip	-	RFQ	데이터시트	510	Bulk	Active	PGA	238 (19 x 19)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
ICA-320-ZWGT .100" SCREW MACHINE DIP SOCKET Samtec Inc.	-	RFQ	데이터시트	ICA	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	10.0µin (0.25µm)	Brass	Polyester, Glass Filled	-55°C ~ 125°C
08-3503-21 CONN IC DIP SOCKET 8POS GOLD Aries Electronics	-	RFQ	데이터시트	503	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
612-43-304-41-004000 SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp.	-	RFQ	데이터시트	612	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	4 (2 x 2)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
612-93-304-41-004000 SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp.	-	RFQ	데이터시트	612	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	4 (2 x 2)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
2-5916783-1 CONN SOCKET PGA ZIF 370POS GOLD TE Connectivity AMP Connectors	-	RFQ	데이터시트	-	Tray	Obsolete	PGA, ZIF (ZIP)	370 (19 x 19)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Copper Alloy	Liquid Crystal Polymer (LCP)	-
APO-320-T-R .100" LOW PROFILE SCREW MACHINE Samtec Inc.	-	RFQ	데이터시트	APO	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-
ICO-318-ZNGG .100" LOW PROFILE SCREW MACHINE Samtec Inc.	-	RFQ	데이터시트	ICO	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Brass	Polyester, Glass Filled	-55°C ~ 125°C
612-11-304-41-001000 SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp.	-	RFQ	데이터시트	612	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	4 (2 x 2)	0.100" (2.54mm)	-	-	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
PGA223H009B5-1819R PGA SOCKET 223 CTS Amphenol ICC (FCI)	-	RFQ	데이터시트	-	-	Active	PGA	223 (18 x 18)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	-	Through Hole	Open Frame	-	-	-	-	-	-	-
123-93-304-41-001000 CONN IC DIP SOCKET 4POS GOLD Mill-Max Manufacturing Corp.	-	RFQ	데이터시트	123	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	4 (2 x 2)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
123-43-304-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	-	RFQ	데이터시트	123	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	4 (2 x 2)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
29-0518-11H CONN SOCKET SIP 29POS GOLD Aries Electronics	-	RFQ	데이터시트	518	Bulk	Active	SIP	29 (1 x 29)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
714-43-123-31-018000 CONN SOCKET SIP 23POS GOLD Mill-Max Manufacturing Corp.	-	RFQ	데이터시트	714	Bulk	Active	SIP	23 (1 x 23)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
APO-314-G-A1 .100" LOW PROFILE SCREW MACHINE Samtec Inc.	-	RFQ	데이터시트	APO	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-
APH-0912-T-T APH-0912-T-T Samtec Inc.	-	RFQ	데이터시트	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-1412-T-T APH-1412-T-T Samtec Inc.	-	RFQ	데이터시트	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-1012-T-T APH-1012-T-T Samtec Inc.	-	RFQ	데이터시트	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-

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