Chipkind 전자 - IC 소켓 - Sockets for ICs, Transistors - 페이지 303 - 원본 상품 출처 - Chipkind 전자- IC 유통업체 및 전자 부품 공급업체

제조업체 부품 번호	가격	수량	데이터시트	시리즈	패키징	제품 상태	유형	위치 또는 핀 수(그리드)	피치 - Mating	접촉 마감 - 결합	접촉 마감 두께 - Mating	접촉 재료 - Mating	장착 유형	기능	종단	피치 - 포스트	접촉 마감 - 포스트	접촉 마감 두께 - 포스트	접촉 재료 - 포스트	하우징 소재	작동 온도
123-87-650-41-001101 CONN IC DIP SOCKET 50POS GOLD Preci-Dip	-	RFQ	데이터시트	123	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	50 (2 x 25)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
HLS-0310-TT-22 .100" SCREW MACHINE SOCKET ARRAY Samtec Inc.	-	RFQ	데이터시트	HLS	Tube	Active	SIP	30 (3 x 10)	0.100" (2.54mm)	Tin	-	-	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	-	-	Thermoplastic	-55°C ~ 140°C
614-83-950-31-012101 CONN IC DIP SOCKET 50POS GOLD Preci-Dip	-	RFQ	데이터시트	614	Bulk	Active	DIP, 0.9" (22.86mm) Row Spacing	50 (2 x 25)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
02-0511-11 CONN SOCKET SIP 2POS GOLD Aries Electronics	-	RFQ	데이터시트	511	Bulk	Active	SIP	2 (1 x 2)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole	-	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
06-2503-21 CONN IC DIP SOCKET 6POS GOLD Aries Electronics	-	RFQ	데이터시트	503	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
06-2503-31 CONN IC DIP SOCKET 6POS GOLD Aries Electronics	-	RFQ	데이터시트	503	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
12-6503-20 CONN IC DIP SOCKET 12POS GOLD Aries Electronics	-	RFQ	데이터시트	503	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	12 (2 x 6)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
12-6503-30 CONN IC DIP SOCKET 12POS GOLD Aries Electronics	-	RFQ	데이터시트	503	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	12 (2 x 6)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
16-0517-90C CONN SOCKET SIP 16POS GOLD Aries Electronics	-	RFQ	데이터시트	0517	Bulk	Active	SIP	16 (1 x 16)	-	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle	-	Solder	-	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
146-83-640-41-035101 CONN IC DIP SOCKET 40POS GOLD Preci-Dip	-	RFQ	데이터시트	146	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
146-83-640-41-036101 CONN IC DIP SOCKET 40POS GOLD Preci-Dip	-	RFQ	데이터시트	146	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
PGA168H008B5-1706R PGA SOCKET 168 CTS Amphenol ICC (FCI)	-	RFQ	데이터시트	-	-	Active	PGA	168 (17 x 17)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	-	Through Hole	Open Frame	-	-	-	-	-	-	-
124-83-432-41-002101 CONN IC DIP SOCKET 32POS GOLD Preci-Dip	-	RFQ	데이터시트	124	Bulk	Active	DIP, 0.4" (10.16mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
HLS-0116-T-10 .100" SCREW MACHINE SOCKET ARRAY Samtec Inc.	-	RFQ	데이터시트	HLS	Tube	Active	SIP	16 (1 x 16)	0.100" (2.54mm)	Tin	-	-	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	-	-	-	Thermoplastic	-55°C ~ 140°C
4594 CONN SOCKET TRANSIST TO100 10POS Keystone Electronics	-	RFQ	데이터시트	-	Bulk	Active	Transistor, TO-100	10 (Round)	-	Tin	-	Brass	Chassis Mount	Closed Frame	Solder	-	Tin	-	Brass	Polyester, Glass Filled	-
116-83-648-41-006101 CONN IC DIP SOCKET 48POS GOLD Preci-Dip	-	RFQ	데이터시트	116	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
13-0511-10 CONN SOCKET SIP 13POS TIN Aries Electronics	-	RFQ	데이터시트	511	Bulk	Active	SIP	13 (1 x 13)	0.100" (2.54mm)	Tin	50.0µin (1.27µm)	Phosphor Bronze	Through Hole	-	Solder	0.100" (2.54mm)	Tin	50.0µin (1.27µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
510-87-159-16-071101 CONN SOCKET PGA 159POS GOLD Preci-Dip	-	RFQ	데이터시트	510	Bulk	Active	PGA	159 (16 x 16)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
116-87-648-41-007101 CONN IC DIP SOCKET 48POS GOLD Preci-Dip	-	RFQ	데이터시트	116	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
HLS-0112-G-2 .100" SCREW MACHINE SOCKET ARRAY Samtec Inc.	-	RFQ	데이터시트	HLS	Tube	Active	SIP	12 (1 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	-	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	-	Thermoplastic	-55°C ~ 140°C

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