Chipkind 전자 - IC 소켓 - Sockets for ICs, Transistors - 페이지 250 - 원본 상품 출처 - Chipkind 전자- IC 유통업체 및 전자 부품 공급업체

제조업체 부품 번호	가격	수량	데이터시트	시리즈	패키징	제품 상태	유형	위치 또는 핀 수(그리드)	피치 - Mating	접촉 마감 - 결합	접촉 마감 두께 - Mating	접촉 재료 - Mating	장착 유형	기능	종단	피치 - 포스트	접촉 마감 - 포스트	접촉 마감 두께 - 포스트	접촉 재료 - 포스트	하우징 소재	작동 온도
510-83-066-11-002101 CONN SOCKET PGA 66POS GOLD Preci-Dip	-	RFQ	데이터시트	510	Bulk	Active	PGA	66 (11 x 11)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
123-83-328-41-001101 CONN IC DIP SOCKET 28POS GOLD Preci-Dip	-	RFQ	데이터시트	123	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
2-1571586-5 CONN IC DIP SOCKET 18POS GOLD TE Connectivity AMP Connectors	-	RFQ	데이터시트	800	Tube	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Gold	25.0µin (0.63µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	25.0µin (0.63µm)	Copper	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 105°C
28-6518-11 CONN IC DIP SOCKET 28POS GOLD Aries Electronics	-	RFQ	데이터시트	518	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
AR32-HZW/T-R CONN IC DIP SOCKET 32POS TIN Assmann WSW Components	-	RFQ	데이터시트	-	Tube	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester, Glass Filled	-40°C ~ 105°C
14-3501-20 CONN IC DIP SOCKET 14POS TIN Aries Electronics	-	RFQ	데이터시트	501	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
14-3501-30 CONN IC DIP SOCKET 14POS TIN Aries Electronics	-	RFQ	데이터시트	501	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
02-7250-10 CONN SOCKET SIP 2POS TIN Aries Electronics	-	RFQ	데이터시트	700 Elevator Strip-Line™	Bulk	Active	SIP	2 (1 x 2)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
02-7350-10 CONN SOCKET SIP 2POS TIN Aries Electronics	-	RFQ	데이터시트	700 Elevator Strip-Line™	Bulk	Active	SIP	2 (1 x 2)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
02-7400-10 CONN SOCKET SIP 2POS TIN Aries Electronics	-	RFQ	데이터시트	700 Elevator Strip-Line™	Bulk	Active	SIP	2 (1 x 2)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
02-7420-10 CONN SOCKET SIP 2POS TIN Aries Electronics	-	RFQ	데이터시트	700 Elevator Strip-Line™	Bulk	Active	SIP	2 (1 x 2)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
02-7425-10 CONN SOCKET SIP 2POS TIN Aries Electronics	-	RFQ	데이터시트	700 Elevator Strip-Line™	Bulk	Active	SIP	2 (1 x 2)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
02-7450-10 CONN SOCKET SIP 2POS TIN Aries Electronics	-	RFQ	데이터시트	700 Elevator Strip-Line™	Bulk	Active	SIP	2 (1 x 2)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
02-7520-10 CONN SOCKET SIP 2POS TIN Aries Electronics	-	RFQ	데이터시트	700 Elevator Strip-Line™	Bulk	Active	SIP	2 (1 x 2)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
02-7540-10 CONN SOCKET SIP 2POS TIN Aries Electronics	-	RFQ	데이터시트	700 Elevator Strip-Line™	Bulk	Active	SIP	2 (1 x 2)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
02-7625-10 CONN SOCKET SIP 2POS TIN Aries Electronics	-	RFQ	데이터시트	700 Elevator Strip-Line™	Bulk	Active	SIP	2 (1 x 2)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
02-7920-10 CONN SOCKET SIP 2POS TIN Aries Electronics	-	RFQ	데이터시트	700 Elevator Strip-Line™	Bulk	Active	SIP	2 (1 x 2)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
116-83-636-41-018101 CONN IC DIP SOCKET 36POS GOLD Preci-Dip	-	RFQ	데이터시트	116	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	36 (2 x 18)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
32-0518-10T CONN SOCKET SIP 32POS GOLD Aries Electronics	-	RFQ	데이터시트	518	Bulk	Active	SIP	32 (1 x 32)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
116-83-328-41-008101 CONN IC DIP SOCKET 28POS GOLD Preci-Dip	-	RFQ	데이터시트	116	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C

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