Chipkind 전자 - IC 소켓 - Sockets for ICs, Transistors - 페이지 25 - 원본 상품 출처 - Chipkind 전자- IC 유통업체 및 전자 부품 공급업체

제조업체 부품 번호	재고 상태	가격	수량	데이터시트	시리즈	패키징	제품 상태	유형	위치 또는 핀 수(그리드)	피치 - Mating	접촉 마감 - 결합	접촉 마감 두께 - Mating	접촉 재료 - Mating	장착 유형	기능	종단	피치 - 포스트	접촉 마감 - 포스트	접촉 마감 두께 - 포스트	접촉 재료 - 포스트	하우징 소재	작동 온도
214-99-624-01-670800 CONN IC DIP SOCKET 24POS TINLEAD Mill-Max Manufacturing Corp.	307	-	RFQ	데이터시트	214	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Tin-Lead	100.0µin (2.54µm)	Beryllium Copper	Surface Mount	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
614-93-308-31-012000 CONN IC DIP SOCKET 8POS GOLD Mill-Max Manufacturing Corp.	284	-	RFQ	데이터시트	614	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
614-43-308-31-012000 CONN IC DIP SOCKET 8POS GOLD Mill-Max Manufacturing Corp.	261	-	RFQ	데이터시트	614	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
D2828-42 CONN IC DIP SOCKET 28POS GOLD Harwin Inc.	229	-	RFQ	데이터시트	D2	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	196.9µin (5.00µm)	Brass	Plastic	-55°C ~ 125°C
D2928-42 CONN IC DIP SOCKET 28POS GOLD Harwin Inc.	193	-	RFQ	데이터시트	D2	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	196.9µin (5.00µm)	Brass	Plastic	-55°C ~ 125°C
24-4518-10 CONN IC DIP SOCKET 24POS GOLD Aries Electronics	508	-	RFQ	데이터시트	518	Bulk	Active	DIP, 0.4" (10.16mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
210-43-624-41-001000 CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp.	158	-	RFQ	데이터시트	210	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
115-43-422-41-003000 CONN IC DIP SOCKET 22POS GOLD Mill-Max Manufacturing Corp.	1,873	-	RFQ	데이터시트	115	Tube	Active	DIP, 0.4" (10.16mm) Row Spacing	22 (2 x 11)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
115-43-320-41-001000 CONN IC DIP SOCKET 20POS GOLD Mill-Max Manufacturing Corp.	232	-	RFQ	데이터시트	115	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
117-87-642-41-005101 CONN IC DIP SOCKET 42POS GOLD Preci-Dip	522	-	RFQ	데이터시트	117	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	42 (2 x 21)	0.070" (1.78mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.070" (1.78mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
116-87-320-41-008101 CONN IC DIP SOCKET 20POS GOLD Preci-Dip	360	-	RFQ	데이터시트	116	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
XR2A-1801-N CONN IC DIP SOCKET 18POS GOLD Omron Electronics Inc-EMC Div	151	-	RFQ	데이터시트	XR2	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 125°C
111-43-320-41-001000 CONN IC DIP SOCKET 20POS GOLD Mill-Max Manufacturing Corp.	200	-	RFQ	데이터시트	111	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
917-43-210-41-005000 CONN SOCKET TRANSIST TO100 10POS Mill-Max Manufacturing Corp.	313	-	RFQ	데이터시트	917	Tube	Active	Transistor, TO-100	10 (Round)	-	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
D2924-42 CONN IC DIP SOCKET 24POS GOLD Harwin Inc.	225	-	RFQ	데이터시트	D2	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	196.9µin (5.00µm)	Brass	Plastic	-55°C ~ 125°C
D2832-42 CONN IC DIP SOCKET 32POS GOLD Harwin Inc.	577	-	RFQ	데이터시트	D2	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	196.9µin (5.00µm)	Brass	Plastic	-55°C ~ 125°C
ICA-628-STT CONN IC DIP SOCKET 28POS TIN Samtec Inc.	8	-	RFQ	데이터시트	ICA	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polyester, Glass Filled	-55°C ~ 105°C
ICA-324-SST .100" SCREW MACHINE DIP SOCKET Samtec Inc.	748	-	RFQ	데이터시트	ICA	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polyester, Glass Filled	-55°C ~ 125°C
4591 CONN TRANSIST TO-5 4POS TIN Keystone Electronics	1,844	-	RFQ	데이터시트	-	Bulk	Active	Transistor, TO-5	4 (Round)	-	Tin	-	Brass	Chassis Mount	Closed Frame	Solder	-	Tin	-	Brass	Polyester, Glass Filled	-
16-0518-00 CONN SOCKET SIP 16POS GOLD Aries Electronics	167	-	RFQ	데이터시트	518	Bulk	Active	SIP	16 (1 x 16)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-

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