Chipkind 전자 - IC 소켓 - Sockets for ICs, Transistors - 페이지 154 - 원본 상품 출처 - Chipkind 전자- IC 유통업체 및 전자 부품 공급업체

제조업체 부품 번호	가격	수량	데이터시트	시리즈	패키징	제품 상태	유형	위치 또는 핀 수(그리드)	피치 - Mating	접촉 마감 - 결합	접촉 마감 두께 - Mating	접촉 재료 - Mating	장착 유형	기능	종단	피치 - 포스트	접촉 마감 - 포스트	접촉 마감 두께 - 포스트	접촉 재료 - 포스트	하우징 소재	작동 온도
C9108-00 CONN IC DIP SOCKET 8POS GOLD Aries Electronics	-	RFQ	데이터시트	Edge-Grip™, C91	Bulk	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
14-0513-10 CONN SOCKET SIP 14POS GOLD Aries Electronics	-	RFQ	데이터시트	0513	Bulk	Active	SIP	14 (1 x 14)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
20-1518-10 CONN IC DIP SOCKET 20POS GOLD Aries Electronics	-	RFQ	데이터시트	518	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
114-87-328-41-134191 CONN IC DIP SOCKET 28POS GOLD Preci-Dip	-	RFQ	데이터시트	114	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
612-83-316-41-001101 CONN IC DIP SOCKET 16POS GOLD Preci-Dip	-	RFQ	데이터시트	612	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
110-87-324-41-105161 CONN IC DIP SOCKET 24POS GOLD Preci-Dip	-	RFQ	데이터시트	110	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
110-024-050 CONN IC DIP SOCKET 24POS GOLD 3M	-	RFQ	데이터시트	100	Bulk	Obsolete	DIP, 0.4" (10.16mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	8.00µin (0.203µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	Flash	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-65°C ~ 125°C
A-ICS-254-12-TT50 IC SOCKET, MACHINED PIN, 7.62MM, Assmann WSW Components	-	RFQ	데이터시트	-	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	12	0.100" (2.54mm)	Nickel	78.7µin (2.00µm)	Beryllium Copper	Through Hole, Right Angle	Open Frame	Solder	0.100" (2.54mm)	Tin	78.7µin (2.00µm)	Brass	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
110-83-314-41-105191 CONN IC DIP SOCKET 14POS GOLD Preci-Dip	-	RFQ	데이터시트	110	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
124-83-310-41-002101 CONN IC DIP SOCKET 10POS GOLD Preci-Dip	-	RFQ	데이터시트	124	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
A48-LCG-T-R CONN IC DIP SOCKET 48POS GOLD Assmann WSW Components	-	RFQ	데이터시트	-	Tube	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Gold	-	-	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	-	-	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 105°C
16-3511-10 CONN IC DIP SOCKET 16POS TIN Aries Electronics	-	RFQ	데이터시트	511	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
4603 CONN TRANSIST TO-3 3POS TIN Keystone Electronics	-	RFQ	데이터시트	-	Bulk	Active	Transistor, TO-3	3 (Oval)	-	Tin	-	Brass	Chassis Mount	Closed Frame	Solder	-	Tin	-	Brass	Polyester, Glass Filled	-
3-822516-7 CONN SOCKET PLCC 32POS TIN TE Connectivity AMP Connectors	-	RFQ	데이터시트	-	Tape & Reel (TR)	Obsolete	PLCC	32 (2 x 7, 2 x 9)	0.050" (1.27mm)	Tin	100.0µin (2.54µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	100.0µin (2.54µm)	Phosphor Bronze	Thermoplastic	-
D2922-42 CONN IC DIP SOCKET 22POS GOLD Harwin Inc.	-	RFQ	데이터시트	D2	Tube	Active	DIP, 0.4" (10.16mm) Row Spacing	22 (2 x 11)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	196.9µin (5.00µm)	Brass	Plastic	-55°C ~ 125°C
299-87-308-11-001101 CONN IC DIP SOCKET 8POS GOLD Preci-Dip	-	RFQ	데이터시트	299	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
116-87-210-41-011101 CONN IC DIP SOCKET 10POS GOLD Preci-Dip	-	RFQ	데이터시트	116	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
116-87-324-41-006101 CONN IC DIP SOCKET 24POS GOLD Preci-Dip	-	RFQ	데이터시트	116	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
410-83-220-10-001101 CONN ZIG-ZAG 20POS GOLD Preci-Dip	-	RFQ	데이터시트	410	Bulk	Active	Zig-Zag, Left Stackable	20 (2 x 10)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
410-83-220-10-002101 CONN ZIG-ZAG 20POS GOLD Preci-Dip	-	RFQ	데이터시트	410	Bulk	Active	Zig-Zag, Right Stackable	20 (2 x 10)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C

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