Chipkind 전자 - IC 소켓 - Sockets for ICs, Transistors - 페이지 128 - 원본 상품 출처 - Chipkind 전자- IC 유통업체 및 전자 부품 공급업체

제조업체 부품 번호	가격	수량	데이터시트	시리즈	패키징	제품 상태	유형	위치 또는 핀 수(그리드)	피치 - Mating	접촉 마감 - 결합	접촉 마감 두께 - Mating	접촉 재료 - Mating	장착 유형	기능	종단	피치 - 포스트	접촉 마감 - 포스트	접촉 마감 두께 - 포스트	접촉 재료 - 포스트	하우징 소재	작동 온도
05-0518-11H CONN SOCKET SIP 5POS GOLD Aries Electronics	-	RFQ	데이터시트	518	Bulk	Active	SIP	5 (1 x 5)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
13-0518-10 CONN SOCKET SIP 13POS GOLD Aries Electronics	-	RFQ	데이터시트	518	Bulk	Active	SIP	13 (1 x 13)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
03-0508-30 CONN SOCKET SIP 3POS GOLD Aries Electronics	-	RFQ	데이터시트	508	Bulk	Active	SIP	3 (1 x 3)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Wire Wrap	-	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6	-55°C ~ 105°C
SIP1X27-014B SIP1X27-014B-SIP SOCKET 27 CTS Amphenol ICC (FCI)	-	RFQ	데이터시트	SIP1x	Bulk	Active	SIP	27 (1 x 27)	0.100" (2.54mm)	Tin-Lead	150.0µin (3.81µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-
116-87-610-41-007101 CONN IC DIP SOCKET 10POS GOLD Preci-Dip	-	RFQ	데이터시트	116	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
110-83-312-41-105101 CONN IC DIP SOCKET 12POS GOLD Preci-Dip	-	RFQ	데이터시트	110	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	12 (2 x 6)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
110-87-324-41-605101 CONN IC DIP SOCKET 24POS GOLD Preci-Dip	-	RFQ	데이터시트	110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
110-87-324-41-005101 CONN IC DIP SOCKET 24POS GOLD Preci-Dip	-	RFQ	데이터시트	110	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
HLS-0102-G-12 .100" SCREW MACHINE SOCKET ARRAY Samtec Inc.	-	RFQ	데이터시트	HLS	Tube	Active	SIP	2 (1 x 2)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	-	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	-	Thermoplastic	-55°C ~ 140°C
ARO 64-HZL/NEC-T SOCKET Assmann WSW Components	-	RFQ	데이터시트	-	Bulk	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
540-99-032-24-000000 CONN SOCKET PLCC 32POS TIN-LEAD Mill-Max Manufacturing Corp.	-	RFQ	데이터시트	540	Tube	Obsolete	PLCC	32 (2 x 7, 2 x 9)	0.050" (1.27mm)	Tin-Lead	200.0µin (5.08µm)	-	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	-	Polyphenylene Sulfide (PPS)	-
AR24-HZL/7/07-TT CONN IC DIP SOCKET 24POS GOLD Assmann WSW Components	-	RFQ	데이터시트	-	Bag	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester	-40°C ~ 105°C
ED044PLCZ CONN SOCKET PLCC 44POS TIN On Shore Technology Inc.	-	RFQ	데이터시트	ED	Tube	Active	PLCC	44 (2 x 22)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polybutylene Terephthalate (PBT)	-55°C ~ 105°C
A-ICS-254-08-TT50 IC SOCKET, MACHINED PIN, 7.62MM, Assmann WSW Components	-	RFQ	데이터시트	-	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8	0.100" (2.54mm)	Nickel	78.7µin (2.00µm)	Beryllium Copper	Through Hole, Right Angle	Open Frame	Solder	0.100" (2.54mm)	Tin	78.7µin (2.00µm)	Brass	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
D2614-42 CONN IC DIP SOCKET 14POS GOLD Harwin Inc.	-	RFQ	데이터시트	D26	Tube	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100" (2.54mm)	Tin	196.9µin (5.00µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
AR 32 HGL-TT SOCKET Assmann WSW Components	-	RFQ	데이터시트	AR	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	32	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	Flash	Brass	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
116-83-308-41-009101 CONN IC DIP SOCKET 8POS GOLD Preci-Dip	-	RFQ	데이터시트	116	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
10-2513-10T CONN IC DIP SOCKET 10POS GOLD Aries Electronics	-	RFQ	데이터시트	Lo-PRO®file, 513	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
09-0518-11 CONN SOCKET SIP 9POS GOLD Aries Electronics	-	RFQ	데이터시트	518	Bulk	Active	SIP	9 (1 x 9)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
11-0518-10H CONN SOCKET SIP 11POS GOLD Aries Electronics	-	RFQ	데이터시트	518	Bulk	Active	SIP	11 (1 x 11)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-

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