- 큰 재고
- 클라우드 가격
IC 소켓
| 사진 | 제조업체 부품 번호 | 재고 상태 | 수량 | 데이터시트 | 시리즈 | 패키징 | 제품 상태 | 유형 | 위치 또는 핀 수(그리드) | 피치 - Mating | 접촉 마감 - 결합 | 접촉 마감 두께 - Mating | 접촉 재료 - Mating | 장착 유형 | 기능 | 종단 | 피치 - 포스트 | 접촉 마감 - 포스트 | 접촉 마감 두께 - 포스트 | 접촉 재료 - 포스트 | 하우징 소재 | 작동 온도 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
110-83-314-41-005101CONN IC DIP SOCKET 14POS GOLD |
0 |
|
데이터시트 |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
110-83-314-41-605101CONN IC DIP SOCKET 14POS GOLD |
0 |
|
데이터시트 |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
614-87-316-41-001101CONN IC DIP SOCKET 16POS GOLD |
0 |
|
데이터시트 |
614 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
116-87-314-41-018101CONN IC DIP SOCKET 14POS GOLD |
0 |
|
데이터시트 |
116 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
116-83-308-41-007101CONN IC DIP SOCKET 8POS GOLD |
0 |
|
데이터시트 |
116 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
110-83-316-01-931101CONN IC DIP SOCKET 16POS GOLD |
0 |
|
데이터시트 |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8), 8 Loaded | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
HLS-0104-T-2.100" SCREW MACHINE SOCKET ARRAY |
0 |
|
데이터시트 |
HLS | Tube | Active | SIP | 4 (1 x 4) | 0.100" (2.54mm) | Tin | - | - | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | - | - | - | Thermoplastic | -55°C ~ 140°C |
|
110-87-428-41-001101CONN IC DIP SOCKET 28POS GOLD |
0 |
|
데이터시트 |
110 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
116-87-210-41-018101CONN IC DIP SOCKET 10POS GOLD |
0 |
|
데이터시트 |
116 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 10 (2 x 5) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
114-83-310-41-134191CONN IC DIP SOCKET 10POS GOLD |
0 |
|
데이터시트 |
114 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 10 (2 x 5) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
116-83-310-41-018101CONN IC DIP SOCKET 10POS GOLD |
0 |
|
데이터시트 |
116 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 10 (2 x 5) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
07-0513-10TCONN SOCKET SIP 7POS GOLD |
0 |
|
데이터시트 |
0513 | Bulk | Active | SIP | 7 (1 x 7) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
|
|
0784990002CONN CAM SOCKET 24POS GOLD |
0 |
|
데이터시트 |
78499 | Tape & Reel (TR) | Obsolete | Camera Socket | 24 (2 x 4, 2 x 8) | 0.024" (0.60mm) | Gold | 12.0µin (0.30µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.024" (0.60mm) | Gold | Flash | Copper Alloy | Plastic | -55°C ~ 85°C |
|
|
08-3513-10CONN IC DIP SOCKET 8POS GOLD |
0 |
|
데이터시트 |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
|
SIP050-1X13-160B1X13-160B-SIP SOCKET 13 CTS |
0 |
|
데이터시트 |
SIP050-1x | Bulk | Active | SIP | 13 (1 x 13) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - |
|
110-87-424-41-005101CONN IC DIP SOCKET 24POS GOLD |
0 |
|
데이터시트 |
110 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
540-99-032-17-400200CONN SOCKET PLCC 32POS TIN-LEAD |
0 |
|
데이터시트 |
540 | Tube | Obsolete | PLCC | 32 (2 x 7, 2 x 9) | 0.050" (1.27mm) | Tin-Lead | 200.0µin (5.08µm) | - | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin-Lead | 200.0µin (5.08µm) | - | Polyphenylene Sulfide (PPS) | - |
|
540-99-028-24-000000CONN SOCKET PLCC 28POS TIN-LEAD |
0 |
|
데이터시트 |
540 | Tube | Obsolete | PLCC | 28 (4 x 7) | 0.050" (1.27mm) | Tin-Lead | 200.0µin (5.08µm) | - | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | - | Polyphenylene Sulfide (PPS) | - |
|
|
AR 50-HGL-TTSOCKET |
0 |
|
데이터시트 |
AR | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 50 | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Brass | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
|
ED032PLCZCONN SOCKET PLCC 32POS TIN |
0 |
|
데이터시트 |
ED | Tube | Active | PLCC | 32 (2 x 16) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT) | -55°C ~ 105°C |
- 1500+ 일일 평균 RFQ 볼륨
- 20,000.000 표준 제품 단위
- 1800+ 전 세계 제조업체
- 15,000+ 재고 창고
