Chipkind 전자 - IC 소켓 - Sockets for ICs, Transistors - 페이지 113 - 원본 상품 출처 - Chipkind 전자- IC 유통업체 및 전자 부품 공급업체

제조업체 부품 번호	가격	수량	데이터시트	시리즈	패키징	제품 상태	유형	위치 또는 핀 수(그리드)	피치 - Mating	접촉 마감 - 결합	접촉 마감 두께 - Mating	접촉 재료 - Mating	장착 유형	기능	종단	피치 - 포스트	접촉 마감 - 포스트	접촉 마감 두께 - 포스트	접촉 재료 - 포스트	하우징 소재	작동 온도
SIP1X17-001B SIP1X17-001B-SIP SOCKET 17 CTS Amphenol ICC (FCI)	-	RFQ	데이터시트	SIP1x	Bulk	Active	SIP	17 (1 x 17)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-
04-0513-11 CONN SOCKET SIP 4POS GOLD Aries Electronics	-	RFQ	데이터시트	0513	Bulk	Active	SIP	4 (1 x 4)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
2-382714-1 CONN IC DIP SOCKET 20POS TIN TE Connectivity AMP Connectors	-	RFQ	데이터시트	Diplomate DL	Tube	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Beryllium Copper	Thermoplastic, Glass Filled	-55°C ~ 105°C
1051631001 SMIA65 CAMERA SOCKET CONTACT Molex	-	RFQ	데이터시트	105163	Tape & Reel (TR)	Obsolete	Camera Socket	12 (2 x 6)	0.037" (0.95mm)	Gold	12.0µin (0.30µm)	Copper Alloy	Surface Mount, Through Board	Open Frame	Solder	0.037" (0.95mm)	Gold	Flash	Copper Alloy	Thermoplastic	-55°C ~ 85°C
1051900001 TOP-MOUNT CAMERA SOCKET FOR SMIA Molex	-	RFQ	데이터시트	105190	Tape & Reel (TR)	Obsolete	Camera Socket	12 (2 x 6)	0.033" (0.85mm)	Gold	12.0µin (0.30µm)	Phosphor Bronze Alloy	Surface Mount	Open Frame	Solder	0.033" (0.85mm)	Gold	Flash	Phosphor Bronze Alloy	Thermoplastic	-55°C ~ 85°C
540-88-032-17-400 CONN SOCKET PLCC 32POS TIN Preci-Dip	-	RFQ	데이터시트	540	Bulk	Active	PLCC	32 (4 x 8)	0.050" (1.27mm)	Tin	-	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polyphenylene Sulfide (PPS)	-
808-AG11D-ESL-LF CONN IC DIP SOCKET 8POS GOLD TE Connectivity AMP Connectors	-	RFQ	데이터시트	800	Tube	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	Flash	Copper	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 105°C
116-83-306-41-007101 CONN IC DIP SOCKET 6POS GOLD Preci-Dip	-	RFQ	데이터시트	116	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
115-87-316-41-003101 CONN IC DIP SOCKET 16POS GOLD Preci-Dip	-	RFQ	데이터시트	115	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
AR 24 HGL-TT SOCKET Assmann WSW Components	-	RFQ	데이터시트	AR	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	Flash	Brass	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
AR 24 HGL/7-TT SOCKET Assmann WSW Components	-	RFQ	데이터시트	AR	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	Flash	Brass	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
110-87-320-41-005101 CONN IC DIP SOCKET 20POS GOLD Preci-Dip	-	RFQ	데이터시트	110	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
110-87-320-41-605101 CONN IC DIP SOCKET 20POS GOLD Preci-Dip	-	RFQ	데이터시트	110	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
233-84 CONN SOCKET PLCC 84POS TIN CNC Tech	-	RFQ	데이터시트	-	Tube	Obsolete	PLCC	84 (4 x 21)	0.050" (1.27mm)	Tin	-	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 105°C
3-382568-2 CONN IC DIP SOCKET 32POS TIN TE Connectivity AMP Connectors	-	RFQ	데이터시트	Diplomate DL	Tube	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Thermoplastic, Glass Filled	-55°C ~ 105°C
614-83-308-31-012101 CONN IC DIP SOCKET 8POS GOLD Preci-Dip	-	RFQ	데이터시트	614	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
114-83-308-41-134191 CONN IC DIP SOCKET 8POS GOLD Preci-Dip	-	RFQ	데이터시트	114	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
A22-LCG-T-R CONN IC DIP SOCKET 22POS GOLD Assmann WSW Components	-	RFQ	데이터시트	-	Tube	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	22 (2 x 11)	0.100" (2.54mm)	Gold	-	-	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	-	-	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 105°C
SIP050-1X10-160B 1X10-160B-SIP SOCKET 10 CTS Amphenol ICC (FCI)	-	RFQ	데이터시트	SIP050-1x	Bulk	Active	SIP	10 (1 x 10)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-
SU1210200000G SU-2*6P RED ; 10.0MM CLIP PLATI Amphenol Anytek	-	RFQ	데이터시트	SU	Bulk	Active	DIP, 0.1" (2.54mm) Row Spacing	12 (2 x 6)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)	-40°C ~ 105°C

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