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IC 소켓
| 사진 | 제조업체 부품 번호 | 재고 상태 | 수량 | 데이터시트 | 시리즈 | 패키징 | 제품 상태 | 유형 | 위치 또는 핀 수(그리드) | 피치 - Mating | 접촉 마감 - 결합 | 접촉 마감 두께 - Mating | 접촉 재료 - Mating | 장착 유형 | 기능 | 종단 | 피치 - 포스트 | 접촉 마감 - 포스트 | 접촉 마감 두께 - 포스트 | 접촉 재료 - 포스트 | 하우징 소재 | 작동 온도 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
116-87-304-41-004101CONN IC DIP SOCKET 4POS GOLD |
0 |
|
데이터시트 |
116 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 4 (2 x 2) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
114-87-312-41-117101CONN IC DIP SOCKET 12POS GOLD |
0 |
|
데이터시트 |
114 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 12 (2 x 6) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
114-87-312-41-134161CONN IC DIP SOCKET 12POS GOLD |
0 |
|
데이터시트 |
114 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 12 (2 x 6) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
AW 127-33/Z-TSOCKET 34 CONTACTS SINGLE ROW |
0 |
|
데이터시트 |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
116-87-306-41-008101CONN IC DIP SOCKET 6POS GOLD |
0 |
|
데이터시트 |
116 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
146-87-306-41-035101CONN IC DIP SOCKET 6POS GOLD |
0 |
|
데이터시트 |
146 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
146-87-306-41-036101CONN IC DIP SOCKET 6POS GOLD |
0 |
|
데이터시트 |
146 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
110-83-308-41-005101CONN IC DIP SOCKET 8POS GOLD |
0 |
|
데이터시트 |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
110-83-308-41-605101CONN IC DIP SOCKET 8POS GOLD |
0 |
|
데이터시트 |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
116-83-306-41-006101CONN IC DIP SOCKET 6POS GOLD |
0 |
|
데이터시트 |
116 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
110-87-314-10-001101CONN IC DIP SOCKET 14POS GOLD |
0 |
|
데이터시트 |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
A-CCS20-GCONN SOCKET PLCC 20POS GOLD |
0 |
|
데이터시트 |
- | Tube | Obsolete | PLCC | 20 (4 x 5) | 0.050" (1.27mm) | Gold | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 105°C |
|
|
110-83-306-41-105161CONN IC DIP SOCKET 6POS GOLD |
0 |
|
데이터시트 |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
614-83-306-31-012101CONN IC DIP SOCKET 6POS GOLD |
0 |
|
데이터시트 |
614 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
115-83-308-41-003101CONN IC DIP SOCKET 8POS GOLD |
0 |
|
데이터시트 |
115 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
110-87-210-41-105101CONN IC DIP SOCKET 10POS GOLD |
0 |
|
데이터시트 |
110 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 10 (2 x 5) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
614-87-310-41-001101CONN IC DIP SOCKET 10POS GOLD |
0 |
|
데이터시트 |
614 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 10 (2 x 5) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
AW 127-31/Z-TSOCKET 31 CONTACTS SINGLE ROW |
0 |
|
데이터시트 |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
A-CCS84-Z-SMCONN SOCKET PLCC 84POS TIN |
0 |
|
데이터시트 |
- | Bag | Obsolete | PLCC | 84 (4 x 21) | 0.050" (1.27mm) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 105°C |
|
|
HLS-0301-TT-12.100" SCREW MACHINE SOCKET ARRAY |
0 |
|
데이터시트 |
HLS | Tube | Active | SIP | 3 (3 x 1) | 0.100" (2.54mm) | Tin | - | - | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | - | Thermoplastic | -55°C ~ 140°C |
- 1500+ 일일 평균 RFQ 볼륨
- 20,000.000 표준 제품 단위
- 1800+ 전 세계 제조업체
- 15,000+ 재고 창고
