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    제조업체 시리즈 패키징 제품 상태 유형 패키지 냉각 부착 방법 모양 길이 너비 직경 핀 높이 온도 상승 시 전력 소모 강제 공기 흐름 시 열 저항 자연 시 열 저항 소재 재료 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    모두 초기화
    모두 적용
    결과
    사진 제조업체 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 패키지 냉각 부착 방법 모양 길이 너비 직경 핀 높이 온도 상승 시 전력 소모 강제 공기 흐름 시 열 저항 자연 시 열 저항 소재 재료 마감
    625-35AB

    625-35AB

    HEATSINK FOR 25MM BGA

    Wakefield-Vette

    348
    RFQ
    625-35AB

    데이터시트

    625 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Pin Fins 0.984" (25.00mm) 0.984" (25.00mm) - 0.350" (8.89mm) - 13.10°C/W @ 200 LFM - Aluminum Black Anodized
    657-10ABPE

    657-10ABPE

    HEATSINK TO-220 W/PINS BLK 1"

    Wakefield-Vette

    807
    RFQ
    657-10ABPE

    데이터시트

    657 Bulk Active Board Level, Vertical TO-218, TO-220, TO-247 Bolt On and PC Pin Rectangular, Fins 1.000" (25.40mm) 1.650" (41.91mm) - 1.000" (25.40mm) 6.0W @ 41°C 3.70°C/W @ 200 LFM - Aluminum Black Anodized
    288-1ABE

    288-1ABE

    HEATSINK FOR TO220

    Wakefield-Vette

    3,312
    RFQ
    288-1ABE

    데이터시트

    288 Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.250" (31.75mm) 0.875" (22.22mm) - 0.215" (5.46mm) 4.0W @ 85°C 12.00°C/W @ 600 LFM 21.20°C/W Aluminum Black Anodized
    HSB32-232318

    HSB32-232318

    HEAT SINK, BGA, 23 X 23 X 18 MM,

    Same Sky (Formerly CUI Devices)

    615
    RFQ
    HSB32-232318

    데이터시트

    HSB Box Active Top Mount BGA Adhesive (Not Included) Square, Pin Fins 0.906" (23.00mm) 0.906" (23.00mm) - 0.709" (18.00mm) 5.9W @ 75°C 4.40°C/W @ 200 LFM 12.67°C/W Aluminum Alloy Black Anodized
    628-25AB

    628-25AB

    HEATSINK FOR 45MM BGA

    Wakefield-Vette

    2,991
    RFQ
    628-25AB

    데이터시트

    628 Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.750" (44.45mm) 1.700" (43.18mm) - 0.250" (6.35mm) 4.5W @ 80°C 7.00°C/W @ 300 LFM - Aluminum Black Anodized
    624-35AB

    624-35AB

    HEATSINK FOR 21MM BGA

    Wakefield-Vette

    5,444
    RFQ
    624-35AB

    데이터시트

    624 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Not Included) Square, Pin Fins 0.827" (21.00mm) 0.827" (21.00mm) - 0.350" (8.89mm) - 15.00°C/W @ 400 LFM - Aluminum Black Anodized
    HSB33-272710

    HSB33-272710

    HEAT SINK, BGA, 27 X 27 X 10 MM,

    Same Sky (Formerly CUI Devices)

    1,044
    RFQ
    HSB33-272710

    데이터시트

    HSB Box Active Top Mount BGA Adhesive (Not Included) Square, Pin Fins 1.063" (27.00mm) 1.063" (27.00mm) - 0.394" (10.00mm) 4.4W @ 75°C 5.30°C/W @ 200 LFM 17.22°C/W Aluminum Alloy Black Anodized
    657-20ABPNE

    657-20ABPNE

    HEATSINK TO-220 W/PINS BLK 2"

    Wakefield-Vette

    1,000
    RFQ
    657-20ABPNE

    데이터시트

    657 Bulk Active Board Level, Vertical TO-218, TO-220, TO-247 Bolt On and PC Pin Rectangular, Fins 1.000" (25.40mm) 1.650" (41.91mm) - 2.000" (50.80mm) 6.0W @ 32°C 2.90°C/W @ 200 LFM - Aluminum Black Anodized
    659-65AB

    659-65AB

    HEATSINK EXTRUSION 37MM

    Wakefield-Vette

    759
    RFQ
    659-65AB

    데이터시트

    659 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Pin Fins 1.450" (36.83mm) 1.450" (36.83mm) - 0.650" (16.51mm) 2.0W @ 20°C 1.50°C/W @ 600 LFM - Aluminum Black Anodized
    624-60AB

    624-60AB

    HEATSINK FOR 21MM BGA

    Wakefield-Vette

    521
    RFQ
    624-60AB

    데이터시트

    624 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Not Included) Square, Pin Fins 0.827" (21.00mm) 0.827" (21.00mm) - 0.600" (15.24mm) - 1.00°C/W @ 400 LFM - Aluminum Black Anodized
    625-60AB

    625-60AB

    HEATSINK FOR 25MM BGA

    Wakefield-Vette

    329
    RFQ
    625-60AB

    데이터시트

    625 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Pin Fins 0.984" (25.00mm) 0.984" (25.00mm) - 0.600" (15.24mm) - 8.00°C/W @ 200 LFM - Aluminum Black Anodized
    628-35AB

    628-35AB

    HEATSINK FOR 45MM BGA

    Wakefield-Vette

    1,997
    RFQ
    628-35AB

    데이터시트

    628 Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) Square, Pin Fins 1.750" (44.45mm) 1.700" (43.18mm) - 0.350" (8.89mm) 3.0W @ 50°C 10.00°C/W @ 150 LFM - Aluminum Black Anodized
    ATS-PCBT1086

    ATS-PCBT1086

    HEATSINK TO-220 W/TAB BLACK

    Advanced Thermal Solutions Inc.

    989
    RFQ
    ATS-PCBT1086

    데이터시트

    - Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.250" (31.75mm) 0.875" (22.22mm) - 0.250" (6.35mm) - 9.50°C/W @ 200 LFM 22.00°C/W Aluminum Black Anodized
    627-15ABPE

    627-15ABPE

    HEATSINK FOR TO218/TO220

    Wakefield-Vette

    410
    RFQ
    627-15ABPE

    데이터시트

    627 Bulk Active Board Level, Vertical TO-218, TO-220, TO-247 Bolt On and PC Pin Rectangular, Fins 0.500" (12.70mm) 1.375" (34.93mm) - 1.500" (38.10mm) 6.0W @ 65°C 5.50°C/W @ 200 LFM - Aluminum Black Anodized
    626-20ABPE

    626-20ABPE

    HEATSINK FOR TO218/TO220

    Wakefield-Vette

    186
    RFQ
    626-20ABPE

    데이터시트

    626 Bulk Active Board Level, Vertical TO-218, TO-220, TO-247 Bolt On and PC Pin Rectangular, Fins 0.500" (12.70mm) 1.375" (34.93mm) - 2.000" (50.80mm) 6.0W @ 55°C 4.70°C/W @ 200 LFM - Aluminum Black Anodized
    657-25ABPNE

    657-25ABPNE

    HEATSINK TO-220 W/PINS BLK 2.5"

    Wakefield-Vette

    970
    RFQ
    657-25ABPNE

    데이터시트

    657 Bulk Active Board Level, Vertical TO-218, TO-220, TO-247 Bolt On and PC Pin Rectangular, Fins 1.000" (25.40mm) 1.650" (41.91mm) - 2.500" (63.50mm) 6.0W @ 25°C 2.70°C/W @ 200 LFM - Aluminum Black Anodized
    655-26AB

    655-26AB

    HEATSINK FOR 40MM BGA

    Wakefield-Vette

    3,946
    RFQ
    655-26AB

    데이터시트

    655 Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.600" (40.64mm) 1.600" (40.64mm) - 0.260" (6.60mm) 5.0W @ 60°C 3.00°C/W @ 500 LFM - Aluminum Black Anodized
    677-10ABPE

    677-10ABPE

    HEATSINK

    Wakefield-Vette

    1,988
    RFQ
    677-10ABPE

    데이터시트

    677 Bulk Active Board Level, Vertical TO-218, TO-220, TO-247, Multiwatt Bolt On and PC Pin Rectangular, Fins 1.000" (25.40mm) 1.650" (41.91mm) - 1.000" (25.40mm) - 3.10°C/W @ 200 LFM - Aluminum Black Anodized
    HSB41-303014P

    HSB41-303014P

    HEAT SINK, BGA, 30 X 30 X 10 MM,

    Same Sky (Formerly CUI Devices)

    410
    RFQ
    HSB41-303014P

    데이터시트

    HSB Box Active Top Mount BGA Push Pin Square, Pin Fins 1.181" (30.00mm) 1.181" (30.00mm) - 0.551" (14.00mm) 5.9W @ 75°C 4.30°C/W @ 200 LFM 12.63°C/W Aluminum Alloy Black Anodized
    HSB39-252509P

    HSB39-252509P

    HEAT SINK, BGA, 25 X 25 X 9 MM,

    Same Sky (Formerly CUI Devices)

    341
    RFQ
    HSB39-252509P

    데이터시트

    HSB Box Active Top Mount BGA Push Pin Square, Pin Fins 0.984" (25.00mm) 0.984" (25.00mm) - 0.354" (9.00mm) 4.3W @ 75°C 6.30°C/W @ 200 LFM 17.53°C/W Aluminum Alloy Black Anodized
    Total 122183 Record«Prev1... 5657585960616263...6110Next»
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