Chipkind 전자 - IC 소켓 - Sockets for ICs, Transistors - 페이지 84 - 원본 상품 출처 - Chipkind 전자- IC 유통업체 및 전자 부품 공급업체

제조업체 부품 번호	가격	수량	데이터시트	시리즈	패키징	제품 상태	유형	위치 또는 핀 수(그리드)	피치 - Mating	접촉 마감 - 결합	접촉 마감 두께 - Mating	접촉 재료 - Mating	장착 유형	기능	종단	피치 - 포스트	접촉 마감 - 포스트	접촉 마감 두께 - 포스트	접촉 재료 - 포스트	하우징 소재	작동 온도
AR06-HZL/01-TT CONN IC DIP SOCKET 6POS GOLD Assmann WSW Components	-	RFQ	데이터시트	-	Bag	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester	-40°C ~ 105°C
AW 127-11/Z-T SOCKET 11 CONTACTS SINGLE ROW Assmann WSW Components	-	RFQ	데이터시트	-	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
SIP1X06-011B SIP1X06-011B-SIP SOCKET 6 CTS Amphenol ICC (FCI)	-	RFQ	데이터시트	SIP1x	Bulk	Active	SIP	6 (1 x 6)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-
01-0518-11 CONN SOCKET SIP 1POS GOLD Aries Electronics	-	RFQ	데이터시트	518	Bulk	Active	SIP	1 (1 x 1)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
HLS-2001-TT-12 .100" SCREW MACHINE SOCKET ARRAY Samtec Inc.	-	RFQ	데이터시트	HLS	Bulk	Active	SIP	20 (20 x 1)	0.100" (2.54mm)	Tin	-	-	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	-	-	Thermoplastic	-55°C ~ 140°C
01-0518-10H CONN SOCKET SIP 1POS GOLD Aries Electronics	-	RFQ	데이터시트	518	Bulk	Active	SIP	1 (1 x 1)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
AW 127-12/Z-T SOCKET 12 CONTACTS SINGLE ROW Assmann WSW Components	-	RFQ	데이터시트	-	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
1825093-1 CONN IC DIP SOCKET 6POS GOLD TE Connectivity AMP Connectors	-	RFQ	데이터시트	Diplomate DL	Tube	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	15.0µin (0.38µm)	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	15.0µin (0.38µm)	Phosphor Bronze	Thermoplastic, Glass Filled	-55°C ~ 125°C
110-87-306-41-005101 CONN IC DIP SOCKET 6POS GOLD Preci-Dip	-	RFQ	데이터시트	110	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
110-87-306-41-605101 CONN IC DIP SOCKET 6POS GOLD Preci-Dip	-	RFQ	데이터시트	110	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
614-87-304-41-001101 CONN IC DIP SOCKET 321POS GOLD Preci-Dip	-	RFQ	데이터시트	614	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	321 (21 x 21)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
DIP308-001B DIP SOCKET 8 CTS Amphenol ICC (FCI)	-	RFQ	데이터시트	-	Bag	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-
110-87-304-41-105101 CONN IC DIP SOCKET 4POS GOLD Preci-Dip	-	RFQ	데이터시트	110	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	4 (2 x 2)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
SIP050-1X03-160B 1X03-160B-SIP SOCKET 3 CTS Amphenol ICC (FCI)	-	RFQ	데이터시트	SIP050-1x	Bulk	Active	SIP	3 (1 x 3)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-
A14-LCG CONN IC DIP SOCKET 14POS GOLD Assmann WSW Components	-	RFQ	데이터시트	-	-	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	-	-	Through Hole	Open Frame	-	0.100" (2.54mm)	Gold	-	-	-	-
1-390262-3 CONN IC DIP SOCKET 32POS TIN TE Connectivity AMP Connectors	-	RFQ	데이터시트	-	Tape & Reel (TR)	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	-	-40°C ~ 105°C
612-87-304-41-001101 CONN IC DIP SOCKET 4POS GOLD Preci-Dip	-	RFQ	데이터시트	612	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	4 (2 x 2)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
AR 08 HGL-TT SOCKET Assmann WSW Components	-	RFQ	데이터시트	AR	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	Flash	Brass	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
01-0518-10T CONN SOCKET SIP 1POS GOLD Aries Electronics	-	RFQ	데이터시트	518	Bulk	Active	SIP	1 (1 x 1)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
110-83-304-41-001101 CONN IC DIP SOCKET 4POS GOLD Preci-Dip	-	RFQ	데이터시트	110	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	4 (2 x 2)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C

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