Chipkind 전자 - IC 소켓 - Sockets for ICs, Transistors - 페이지 74 - 원본 상품 출처 - Chipkind 전자- IC 유통업체 및 전자 부품 공급업체

제조업체 부품 번호	재고 상태	가격	수량	데이터시트	시리즈	패키징	제품 상태	유형	위치 또는 핀 수(그리드)	피치 - Mating	접촉 마감 - 결합	접촉 마감 두께 - Mating	접촉 재료 - Mating	장착 유형	기능	종단	피치 - 포스트	접촉 마감 - 포스트	접촉 마감 두께 - 포스트	접촉 재료 - 포스트	하우징 소재	작동 온도
299-43-324-10-001000 CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp.	85	-	RFQ	데이터시트	299	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
299-93-324-10-001000 CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp.	25	-	RFQ	데이터시트	299	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
510-93-049-07-000001 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	6	-	RFQ	데이터시트	510	Tube	Active	DIP, 0.1" (2.54mm) Row Spacing	49 (7 x 7)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Solder	-	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
123-93-640-41-801000 CONN IC DIP SOCKET 40POS GOLD Mill-Max Manufacturing Corp.	10	-	RFQ	데이터시트	123	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame, Decoupling Capacitor	Wire Wrap	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
123-43-964-41-001000 CONN IC DIP SOCKET 64POS GOLD Mill-Max Manufacturing Corp.	86	-	RFQ	데이터시트	123	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	64 (2 x 32)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
44-3572-11 CONN IC DIP SOCKET ZIF 44POS GLD Aries Electronics	50	-	RFQ	데이터시트	57	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	44 (2 x 22)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
44-3573-11 CONN IC DIP SOCKET ZIF 44POS GLD Aries Electronics	47	-	RFQ	데이터시트	57	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	44 (2 x 22)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
210-83-308-41-101000 CONN IC DIP SOCKET 8POS GOLD Mill-Max Manufacturing Corp.	27	-	RFQ	데이터시트	210	Tube	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	300.0µin (7.62µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
110-83-308-41-530000 CONN IC DIP SOCKET 8POS GOLD Mill-Max Manufacturing Corp.	21	-	RFQ	데이터시트	110	Tube	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	300.0µin (7.62µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
110-83-316-41-530000 CONN IC DIP SOCKET 16POS GOLD Mill-Max Manufacturing Corp.	49	-	RFQ	데이터시트	110	Tube	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	300.0µin (7.62µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
110-83-318-41-530000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	21	-	RFQ	데이터시트	110	Tube	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	300.0µin (7.62µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
110-83-628-41-530000 CONN IC DIP SOCKET 28POS GOLD Mill-Max Manufacturing Corp.	50	-	RFQ	데이터시트	110	Tube	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	300.0µin (7.62µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
CAP-002-01-00 0603 Capacitor Test Socket MiS Technologies	17	-	RFQ	데이터시트	-	Bulk	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
S582-11-898-15-001414 898 POS BGA SOCKET .050 Mill-Max Manufacturing Corp.	3	-	RFQ	데이터시트	-	Bulk	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
S530-10-898-15-001406 898 POS BGA HEADER .050 Mill-Max Manufacturing Corp.	5	-	RFQ	데이터시트	-	Bulk	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
108493-0014 DDR Socket, 96 BGA 7.5 mm x 13.1 Ironwood Electronics	25	-	RFQ	데이터시트	Grypper	Bag	Active	BGA	96 (9 x 16)	0.031" (0.80mm)	-	-	-	-	-	Solder	-	-	-	-	-	-
108493-0015 DDR Socket, 96 BGA 7.5 mm x 13.1 Ironwood Electronics	25	-	RFQ	데이터시트	Grypper	Bag	Active	BGA	96 (9 x 16)	0.031" (0.80mm)	-	-	-	-	-	Solder	-	-	-	-	-	-
107022-0048 DDR Socket, 78 BGA 7.5 mm x 10.6 Ironwood Electronics	23	-	RFQ	데이터시트	Grypper	Bag	Active	BGA	78 (6 x 13)	0.031" (0.80mm)	-	-	-	-	-	Solder	-	-	-	-	-	-
108387-0059 Socket-eMMC/UFS, 153 BGA 10.0 mm Ironwood Electronics	23	-	RFQ	데이터시트	-	Bag	Active	BGA	153 (12 x 13)	0.020" (0.50mm)	-	-	-	Through Hole	-	Solder	0.020" (0.50mm)	-	-	-	-	-
107250-0026 Socket-eMMC/UFS, 153 BGA 11.5 mm Ironwood Electronics	21	-	RFQ	데이터시트	-	Bag	Active	BGA	153 (12 x 13)	0.020" (0.50mm)	-	-	-	Through Hole	-	Solder	0.020" (0.50mm)	-	-	-	-	-

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